6. Conclusion

The main objective of this chapter is to propose a new theory called nonlinear generalized thermoelasticity involving three-temperature and new BEM model for the solution of problems which are associated with the proposed nonlinear theory, where we used the three-temperature radiative heat conduction equations coupled with electron, ion and phonon temperatures to describe the thermal stresses in anisotropic circular cylindrical plate structures. It can be concluded from numerical results of our proposed model that the generalized theories of thermoelasticity can be connected with the three-temperature radiative heat conduction to describe the deformation of anisotropic circular cylindrical plate structures. The validity and accuracy of the proposed model was examined and confirmed by comparing the obtained results with those known previously. Because there are no available data to confirm the validity and accuracy of our results, we replace the three-temperature radiative heat conduction results with one-temperature heat conduction results as a special case from results of our current general model for circular cylindrical plate structures. In the special case under consideration, the results obtained with the BEM have been compared graphically with the FEM results of COMSOL Multiphysics software version 5.4. Excellent agreement is obtained between BEM results and FEM results. Understanding the behaviour of the three-temperature thermal stresses in anisotropic circular cylindrical plate structures should be a key for extending the application of these behaviors to a wide range of structures. The

A New Computerized Boundary Element Model for Three-Temperature Nonlinear Generalized… DOI: http://dx.doi.org/10.5772/intechopen.90053

numerical results for our general model which is associated with our proposed theory may provide interesting information for computer scientists and engineers, geotechnical and geothermal engineers, researchers who will industrialize the thermoelastic devices using additive manufacturing and the materials designers and developers, etc.
