**2.4 Finite element simulation of micromachining of nanosized silicon: carbide particle reinforced composite**

The nanosized silicon – carbide – particle (SICp) reinforced aluminum matrix composite's micromachining process had been studied [6] using finite element

*Finite Element Analysis in Nanotechnology Research DOI: http://dx.doi.org/10.5772/intechopen.94590*

method. The parameters of cohesive zone model had been found from stress – displacement curves of the molecular dynamics (MD) simulation. The model represented exactly the random properties of silicon – carbide particle distribution and the interfacial bonding between SICp and matrix [6]. The mechanism of machining was analyzed as per chip morphology, stress variation, temperature and cutting force. The FE simulation projected the fact that SICp caused non uniform interaction between the tool and reinforcement. The deformation mechanics [6] led to inhomogeneous stress variation and irregular cutting force.
