**5. Conclusions**

Both the 90% Cu-10% Ni alloy and copper are dissolved, in the Tafel region, by a mechanism consisting of two steps that occur simultaneously. However, the kinetics of copper dissolution results in significant changes in the dissolution process of the alloy.

Corrosion potential in more active regions and smaller corrosion rates due to the presence of nickel in the alloy, generate significant differences between these metals.

Due to the fact that the 90% Cu-10% Ni-X% LiBr system always polarized in comparison to the nickel equilibrium potential, and only sometimes compared to the copper equilibrium potential, the anodic reaction can not be considered reversible, and according to the dissolution mechanism, is under activation control.

According to the proposed equivalent circuit, the dissolution process of the alloy is in fact under a mixed kinetic control, by activation and diffusion. However, the mass transport resistance under all experimental conditions is higher than that observed for charge transfer. On the other hand, as both elements are part of a series, the one representing the mass transport process is the one that shows a greater resistance to current flow. Thus, the diffusion phenomenon must be the process that controls the dissolution of the alloy.

For the dissolution process to be maintained, the reacting species must match at the interface in an electrochemical process. In this sense the complex ion is generated at the interface of the film (equation 13) and spreads to the bulk of the solution. Therefore, oxygen is responsible for the diffusion phenomenon, and does not always follow the Levich relationship.
