**7. References**


Mass Transfer in the Electro-Dissolution of

pp. 1897-1903

109-135

States of America

pp. 427-432

515-518

1972), pp. 661-662

(september 1996), pp. 1537-1548

131, No. 6, (june 1984), pp. 1219-1224

90% Copper-10% Nickel Alloy in a Solution of Lithium Bromide 529

Itzhak D. & Greenberg T. (1999). Galvanic Corrosion of a Copper Alloy in Lithium Bromide Heavy Brine Environments. *Corrosion,* Vol. 55, No. 8, (august 1999), pp. 795-799 Kato C., Ateya B. G., Castle J. E. & Pickering H. W. (1980). On the Mechanism of Corrosion

Kato C. & Pickering H. W. (1984). A Rotating Disk Study of the Corrosion Behavior of Cu-

Kear G., Barker B. D. & Walsh F. C. (2004). Electrochemical corrosion of unalloyed copper in

Kear G., Barker B. D., Stokes K. & Walsh F. C. (2004). Electrochemical corrosion behaviour of

Kear G., Barker B. D., Stokes K. R. & Walsh F. C. (2007). Electrochemistry of non-aged 90-10

anodic characteristics. *Electrochimica Acta*, Vol. 52, (july 2006), pp. 1889-1898 Kusik C. L. & Meissner H. P. (1978). Electrolyte Activity Coefficients in Inorganic

Kutz M. (2002). *Handbook of Materials Selection*, John Wiley & Sons, Inc., New York United

Lee H. P. & Nobe K. (1984). Rotating Ring-Electrode Studies of Cu-Ni Alloy

Mansfeld F. & Uhlig H. H. (1970). Effect of Electron Donor and Acceptor Elements an

Mansfeld F. (1973). Simultaneous Determination of Instantaneous Corrosion Rates and Tafel

Mansfeld F. (1973). Tafel Slopes and Corrosion Rates from Polarization Resistance Measurements, *Corrosion*, Vol. 29, No. 10, (october 1973), pp. 397-402 Martínez-Meza E. (2011). Corrosión e Inhibición Sobre Acero, Cobre y Aleaciones en

Meissner H. P. & Tester J. W. (1972). Activity Coefficients of Strong Electrolytes in Aqueous Solutions. *Ind. Eng. Chem. Process Des. Develop*., Vol. 11, No. 1, pp. 128-133 Meissner H. P., Kusik C. L. & Tester J. W. (1972). Activity Coefficients of Strong Electrolytes

Milosev I. & Metikos H. M. (1997). The behaviour of Cu-xNi (x = 10 to 40 %) alloys in

*Electrochemistry*, Vol. 34, No. 55, (january 2004), pp. 659-669

*J. Electrochem. Soc.*, Vol. 131, No. 6, (june 1984), pp. 1236-1243

*Tesis*. Universidad Nacional Autónoma de México, México D.F.

Symposium Series, Vol. 74, No.173, (1978), pp. 14-20

of Cu-9.4Ni-1.7Fe Alloy in air Saturated Aqueous NaCl Solution. I Kinetic Investigations. *J. Electrochem. Soc.*, Vol. 127, No. 9, (september 1980), pp. 1890-1896 Kato C., Castle J. E., Ateya B. G. & Pickering H. W. (1980). On the Mechanism of Corrosion

of Cu-9.4Ni-1.7Fe Alloy in air Saturated Aqueous NaCl Solution. II Composition of the Protective Surface Layer. *J. Electrochem. Soc.*, Vol. 127, No. 9, (september 1980),

9.4Ni-1.7Fe Alloy in Air-Saturated Aqueous NaCl Solution, *J. Electrochem. Soc*., Vol.

chloride media – a critical review. *Corrosion Science*, Vol. 46, (december 2002), pp.

90-10Cu-Ni alloy in chloride media – based electrolytes. *Journal of Applied* 

copper-nickel alloy (UNS C70610) as a function of fluid flow Part 1: Cathodic and

Processing. Fundamentals Aspects of Hydrometallurgical Processes, *AIChE*

Electrodissolution in Acidic Chloride Solution, A Commercial Cu-Ni (90/10) Alloy.

Passivity of Copper-Nickel Alloys*. J. Electrochem. Soc*., Vol. 117, No. 4, (april 1970),

Slopes from Polarization Resistance Measurements. *J. Electrochemical Soc*.: ELECTROCHEMICAL SCIENCE AND TECHNOLOGY. Vol. 120, (april 1973), pp.

Solución Refrigerante de Bromuro de Litio, Empleada en Bombas de Calor. *Ph. D* 

in Aqueous Solutions-Effect of Temperature. *AIChE Journal*, Vol. 18, No. 3, (may

alkaline solutions containing chloride ions. *Electrochimica Acta*, Vol. 42, No. 10,

Publishers, New York, 0-306-46166-8 (Hardbound), 0-306-46167-6 (paperbound), Printed in the United States of America


Brossard L. (1984). Potentiodynamic Investigation of Copper in LiCl Solutions. *Corrosion,*

Brossard L. (1984). Potentiodynamic Investigation of Copper in the Presence of Bromide

Brossard R. L. & Raynaud G. M. (1985). Influence of Temperature on copper bromide formation and dissolution. *Can. J. Chem*., Vol. 63, (april 1984), pp. 720-724 Cooper R. S. & Bartlett J. H. (1958). Convection and Film Instability, Copper anodes in

Criss C. M. & Cobble J. W. (1964). The Thermodynamic Properties of High Temperature

Crundwell F. K. (1991). The Anodic Dissolution of 90% Copper-10% Nickel alloy in

Dean John A. (1989). Manual de Química Lange, Decimotercera Edición McGraw-Hill, 13ª

Deslouis C., Tribollet B., Mengoli G. & Musiani M. M. (1988). Electrochemical behaviour of

Deslouis C., Tribollet B., Mengoli G. & Musiani M. M. (1988). Electrochemical behaviour of

Deslouis C., Mattos O. R., Musiani M. M. & Tribollet B. (1993). Comments on Mechanism of

Dhar H. P., White R. E., Darby R., Cornwell L. R., Griffin R. B. & Burnell G. (1985). Corrosion

Flitt H. J. & Schweinsberg D. P. (2005). A Guide to Polarisation curve interpretation:

Fontana M. G. & Greene N. D. (1978). *Corrosion Engineering (second edition)* McGraw-Hill Book Company, 0-07-021461-1, Printed in the United States of America Hack H. P. & Pickering H. W. (1991). AC Impedance Study of Cu and Cu-Ni Alloys in

Hassibi A., Navid R., Dutton R. W. & Lee T. H. (2004). Comprehensive study of noise

Heng J. & Johnston H. L. (1952). Low Temperature Heat Capacity of Inorganic Solids XII.

Ions. *J. Electrochem. Soc*., Vol. 131, No. 8, (1984), pp. 1847-1849

http:/www.copper.org/applications/cuni/visual\_overview/full-text.htm

Principle. *J. Am. Chem Soc.,* Vol. 86, (december 1964), pp. 5385-5401

*Applied Electrochemistry*, Vol. 18, (october 1987), pp. 374-383

*Applied Electrochemistry*, Vol. 18, (october 1987), pp. 384-393

system. *Corros. Sci*., 47, (february 2005), pp. 2125-2156

Soc., Vol. 138, No. 3, (March 1991), pp. 690 – 695

Printed in the United States of America

Vol. 40, No. 8, (august 1984), pp. 420-425

*Copper-Nickel Alloys in Marine Environments*, available from,

1958), pp. 109-116

2135-2141

Impreso en México

(july 1993), pp. 2781-2783

(April 2004), pp. 1074 – 1082

41, pp. 193-196

Publishers, New York, 0-306-46166-8 (Hardbound), 0-306-46167-6 (paperbound),

Hydrochloric Acid. *Journal of the Electrochemical Society*, Vol. 105, No. 5, (march

Aqueous Solutions. IV. Entropies of the ions up to 200ºC and the Correspondence

Hydrochloric Acid Solution. *Electrochimica Acta*, Vol. 36, No. 14, (february 1991), pp.

edición, 968-422-087-1 (obra completa) Tomo IV, paginas, 9-20, 9-106, 9-107, 9-118

copper in neutral aereated chloride solution. I Steady-State investigation. *Journal of* 

copper in neutral aereated chloride solution. II Impedance investigation. *Journal of* 

copper electrodissolution in chloride media. *Electrochimica Acta*, Vol. 38, No. 18,

Behavior of 70Cu-30Ni Alloy in 0.5 NaCl and in Synthetic Seawater. *Corrosion*, Vol.

deconstruction of experimental curves typical of the Fe/H2O/H+/O2 corrosion

Aerated Salt Water. I. Pd Coating and Corrosion Product Stripping. *J. Electrochem*.

processes in electrode electrolyte interfaces. *Journal of Applied Physics,* Vol. 96, No. 2,

Heat Capacity and Thermodynamic Properties of Cuprous Bromide from 16 to 300 K. *The Journal of the American Chemical Society*, Vol. 74, (october 1952), pp. 4771-472


**23** 

*China* 

**Interfacial Mass Transfer and Morphological** 

*State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050,* 

Mass transfer near the solid-liquid interface is a fundamental problem in crystal growth and it is also a prerequisite for producing high-quality homogeneous crystals. It is desired that the mass transport phenomenon in the liquid phase can be visualized simultaneously with the growing interface. Such information is very helpful for the understanding of crystal growth mechanism. But little is known about the direct connection between mass transport and interfacial morphology in oxide crystal growth, mainly because it is technically difficult

In the present chapter of the book, we take high-temperature melt (or solution) growth of oxide crystal as an example, to study the interfacial mass transport and its effect on the interfacial morphology. Most of the results are based on the experiments performed in a high-temperature in situ observation system developed by the authors (W. Q. Jin, et al., 1993), which will be firstly introduced in the following. This system is designed specially for visualizing and recording the mass transport as well as the growth process under the condition of high temperature. After that we will show the typical buoyancy and Marangoni convections in-situ observed in high temperature oxide melt in a loop-like heater. The effect of convection on the thickness of interfacial boundary layer will also be demonstrated. Then, we will discuss the diffusion-induced microconvection near the solid-liquid interface and

The next section is devoted to deriving the correlation between the mass transfer and the interfacial morphology. After that, we shall see how external forces, such as magnetic field and mechanical vibration, stabilize the unsteady convection. Coupled with the help of external forces, effect of mass transfer near solid-liquid interface is optimized and then bulk oxide crystals with high quality are obtained by vertical zone-melting technique or vertical Bridgman growth technique. Finally, we will give a short summary and express our

Crystal growth is a dynamic process which is composed of the mass and heat transport and interface kinetics. In this part, a high temperature in situ observation method coupling differential interference microscope and the Schlieren techniques will be introduced. The

to visualize interface growth with mass flow in the high-temperature environment.

**1. Introduction** 

the mass transport in the boundary layer.

**2. High-temperature in situ observation system** 

acknowledgments.

**Instability of Oxide Crystal Growth** 

Xiuhong Pan, Weiqing Jin and Yan Liu

