**Author details**

Hongcheng Ruan1 , Yu Huang2 , Yuqian Chen<sup>2</sup> and Fuwei Zhuge2 \*

1 School of Information and Safety Engineering, Zhongnan University of Economics and Law, Wuhan, China

2 State Key laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan, China

\*Address all correspondence to: zhugefw@hust.edu.cn

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
