**Author details**

Karel Dušek\*, David Bušek and Petr Veselý Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Prague, Czech Republic

\*Address all correspondence to: karel.dusek@fel.cvut.cz

© 2020 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

**135**

*Overview of Selected Issues Related to Soldering DOI: http://dx.doi.org/10.5772/intechopen.91023*

Science: Materials in Electronics.

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[8] Ma H. Effects of temperature and strain rate on the mechanical properties of lead-free solders. Journal of Materials

[9] Pietriková A, Durisin J, Ďurišin J. VPS and reliability of solder joint. In: 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME). 2009. pp. 395-398. DOI: 10.1109/SIITME.2009.5407338

[10] Rudajevova A, Dušek K. Residual strain in PCBs with Cu-plated holes. Journal of Electronic Materials.

[11] Pietriková A, Ďurišin J, Mach P. Diagnostika a optimalizácia pou žitia ekologických materiálov pre vodivé spájanie v elektronike. 1. vydanie. Košice: Fakulta elektrotechniky a informatiky Technickej university v Košiciach; 2010

[12] Zero-defect printing shifts blame for poor-quality soldering. 31 July 2002. Zetech. Dataweek n.d. Available from: http://www.dataweek.co.za/news. aspx?pklnewsid=7525 [Accessed: 20

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[14] Dusek K, Straka V, Brejcha M, Beshajova Pelikanova I. Influence of type of reflow technology and type of surface finish on tomb stone effect. In: 2013 36th International Spring Seminar on Electronics Technology (ISSE), IEEE.

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[1] Dušek K, Plaček M, Bušek D, Dvořáková K, Rudajevová A. Study of influence of thermal capacity and flux activity on the solderability. In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (ISSE), IEEE.

[2] Bušek D, Dušek K, Plaček M, Urbánek J, Horník J, Holec J. Determination of BGA solder joint detachment cause-warpage effect. In: 2015 38th International Spring Seminar on Electronics Technology (ISSE), IEEE.

[3] Otáhal A, Adamek M, Jansa V, Szendiuch I. Investigation of the mechanical properties of lead-free solder materials. Key Engineering Materials. 2014;**592-593**:453-456. DOI: 10.4028/www.scientific.net/

[4] Dušek K, Bušek D, Beran T, Rudajevova A. Comparison of shear strength of soldered SMD resistors for various solder alloys. In: 2015 38th International Spring Seminar on Electronics Technology (ISSE), IEEE.

[5] Garami T, Krammer O, Harsányi G, Martinek P. Method for validating CT length measurement of cracks inside solder joints. Soldering & Surface Mount Technology. 2016;**28**:13-17

[6] Long G, Embree T, Mukadam M, Parupalli S, Vasudevan V. Lead free assembly impacts on laminate material properties and pad crater failures. In: IPC APEX/EXPO

[7] Dušek K, Rudajevová A. Influence of latent heat released from solder joints II: PCB deformation during reflow and pad cratering defects. Journal of Materials

2014. pp. 185-188

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*Overview of Selected Issues Related to Soldering DOI: http://dx.doi.org/10.5772/intechopen.91023*
