**1. FAB advanced furnace process of 12**<sup>0</sup> **nm 7 nm**

The semiconductor plant investment exceeds 3 billion US dollars, and the basic operating cost per day exceeds 6 million US dollars, although this process is very important, especially in commercial key sizes below 12 nm (**Figure 1**) [1, 2]. However, modern semiconductor manufacturing has five major difficulties, which are summarized in **Table 1**. Semiconductor refers to the material whose conductivity is between conductor and insulator at normal temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. Such as diode is a device made of semiconductor. Whether from the perspective of technology or economic development, the importance of semiconductors is very huge [3, 4]. 5G and artificial intelligence technologies are the main application areas of advanced technology. For example, in 2019, many mobile phone manufacturers launched 5G models, and most of these models used

**Topic Explanation**

*DOI: http://dx.doi.org/10.5772/intechopen.92849*

than 10 billion.

*Study on IoT and Big Data Analysis of 12" 7 nm Advanced Furnace Process Exhaust Gas Leakage*

so on.

*Summary five major difficulties of modern semiconductor manufacturing.*

Mass production technology The process flow constructed by the R & D center through

*The layout and actual state of the FAB 12-inch 7 nm furnace equipment selected for this study. (a) 12*

is becoming more and more obvious.

The number of transistors integrated on a chip is increasing, from the 1960s to the present, from one transistor to more

The key size was reduced from 1um in 1988 to 5 nm in 2020, a reduction of 99.5%. From this perspective, the difficulty of integrated circuit manufacturing is gradually increasing, and the acceleration of the difficulty is also increasing.

The process technology that constitutes the smallest unit of the semiconductor manufacturing process is the single-point technology, especially the photolithography process. The manufacturing process of complex circuits exceeds 500 processes. These processes are carried out under precision instruments, which are not clear to human eyes.

The difficulty of integrating technology lies in how to complete a technological process with low cost, satisfactory specifications and complete operation from an unlimited combination of component technologies in a short time. This includes operators, process equipment, raw materials, process parameters and methods, FAB environmental conditions and

integrated technology is transferred to the mass production plant. Strict exact copying is basically impossible. Even if the equipment in the development center and the mass production plant are the same, the same result may not be obtained under the same process conditions. This is because even with the same equipment, there will be a slight performance difference between the two machines. Therefore, with the continuous improvement of the degree of semiconductor precision, the problem of machine difference

Integration is getting higher and

Difficult to break through some specific single-point technology

Need to integrate multiple

technologies

**Table 1.**

**Figure 2.**

**81**

*advanced furnace process tool, (b) FAB layout.*

The higher the accuracy requirements, the more difficult the process.

higher

**Figure 1.**

*Development trend of key dimensions of wafer manufacturing in 2020.*

12.01 7.01 advanced technology baseband chips, such as Qualcomm Snapdragon X50, MediaTek Helio M70, Intel XMM8000 series, Samsung Exynos 5000 series, Hisilicon Balong 5000 series, etc. This creates a potential demand for semiconductor equipment. 5G and artificial intelligence will not only bring the semiconductor equipment market back to a short term in 2020, but also support the development of the semiconductor equipment industry in the long term. The research and development organization predicts the technology trend in 2020, and the research and development of Toyo, a subsidiary of Jibang, predicts that the semiconductor industry will gradually come out of the bottom in 2020 with the continuous increase in demand for 5G, AI, automotive and other emerging applications. Among them, 5G transformative technologies are the most critical. The Industrial Intelligence Institute (MIC) of the China Resources Planning Association pointed out that this year, about 56 telecom operators in 32 countries have announced the deployment of 5G networks, of which 39 telecom operators have officially opened 5G services. It is estimated that by 2020, there will be 170 telecom providers worldwide providing 5G commercial services [5, 6].

Combining the foregoing, in order to achieve high accuracy and high throughput, modern FAB uses a large number of high-energy processes, such as plasma, CVD, and ion implantation. This furnace is one of the important tools for semiconductor manufacturing (**Figure 2**). Due to the high energy, the physicochemical changes in each reactor are very complex, and it is often impossible to determine the type and concentration of the by-products produced, and the type and concentration of these by-products often change randomly. These by-products usually cause the following effects on FAB, including: (1) Incompatibility between byproducts may increase the toxicity or explosiveness of the gas in the pipeline; (2) By-products may corrode the exhaust pipe or make it brittle (3) If the type and concentration of by-products cannot be determined, it is impossible to select the appropriate exhaust gas treatment equipment; (4) The currently used processing

*Study on IoT and Big Data Analysis of 12" 7 nm Advanced Furnace Process Exhaust Gas Leakage DOI: http://dx.doi.org/10.5772/intechopen.92849*


#### **Table 1.**

12.01 7.01 advanced technology baseband chips, such as Qualcomm Snapdragon X50, MediaTek Helio M70, Intel XMM8000 series, Samsung Exynos 5000 series, Hisilicon Balong 5000 series, etc. This creates a potential demand for semiconductor equipment. 5G and artificial intelligence will not only bring the semiconductor equipment market back to a short term in 2020, but also support the development of the semiconductor equipment industry in the long term. The research and development organization predicts the technology trend in 2020, and the research and development of Toyo, a subsidiary of Jibang, predicts that the semiconductor industry will gradually come out of the bottom in 2020 with the continuous increase in demand for 5G, AI, automotive and other emerging applications. Among them, 5G transformative technologies are the most critical. The Industrial Intelligence Institute (MIC) of the China Resources Planning Association pointed out that this year, about 56 telecom operators in 32 countries have announced the deployment of 5G networks, of which 39 telecom operators have officially opened 5G services. It is estimated that by 2020, there will be 170 telecom providers worldwide providing

*Development trend of key dimensions of wafer manufacturing in 2020.*

*Linked Open Data - Applications,Trends and Future Developments*

Combining the foregoing, in order to achieve high accuracy and high throughput, modern FAB uses a large number of high-energy processes, such as plasma, CVD, and ion implantation. This furnace is one of the important tools for semiconductor manufacturing (**Figure 2**). Due to the high energy, the physicochemical changes in each reactor are very complex, and it is often impossible to determine the type and concentration of the by-products produced, and the type and concentration of these by-products often change randomly. These by-products usually cause the following effects on FAB, including: (1) Incompatibility between byproducts may increase the toxicity or explosiveness of the gas in the pipeline; (2) By-products may corrode the exhaust pipe or make it brittle (3) If the type and concentration of by-products cannot be determined, it is impossible to select the appropriate exhaust gas treatment equipment; (4) The currently used processing

5G commercial services [5, 6].

**Figure 1.**

**80**

*Summary five major difficulties of modern semiconductor manufacturing.*

#### **Figure 2.**

*The layout and actual state of the FAB 12-inch 7 nm furnace equipment selected for this study. (a) 12 advanced furnace process tool, (b) FAB layout.*

equipment may be damaged, which may affect the processing efficiency [7–9]. As of 2020, there are already 37 semiconductor wafers FABs in Taiwan. Taking the 12-inch FAB as an example, there are about 420 various types of main process machines in a manufacturing plant with a monthly capacity of 50,000 wafers, of which about 63 are thin film process machines, photolithography process machine also has about 55, summary of Taiwan IC manufacturing FABs show in **Table 2** [10].

Under this premise, in order to make the above software and hardware system intelligent, add the IoT module to the original module, so that we can continuously obtain various process parameters and information required by FAB in the 12″ furnace process tool. Through 24 hr of continuous Processing and thousands of processing machines, we will obtain a large amount of data to confirm the above production requirements, so that we can effectively master the FAB characteristics, improve production efficiency, improve product yield and establish a safe and healthy product line and employee working environment It is an important

*Study on IoT and Big Data Analysis of 12" 7 nm Advanced Furnace Process Exhaust Gas Leakage*

The core of the FTIR is the Michealson interferometer. Its principle is that the two infrared beams after the infrared light source is split by the beam splitter are respectively directed to the fixed mirror and the moving mirror, and then combined into A single infrared ray, due to the difference in optical path formed by the moving mirror, makes the final combined infrared ray form an infrared beam of different energy due to destructive and constructive interference. It has a fast analysis speed, is not destructive to the sample, and can analyze solid liquid and gas samples, making it gradually become an indispensable qualitative tool for material analysis. In certain circumstances, it can even achieve the ability to quickly screen

The instrument used in this study is aspirated FTIR. The pumped FTIR uses a pump to introduce the gas to be tested into the FTIR detection chamber for immediate analysis. The measurement method is shown in **Figure 3**. The main components of the pumped FTIR include infrared sources, interferometers, beam splitters, fixed mirrors, moving mirrors and gas chambers, detectors and electronic modules, etc. In addition, there must be a sampling tube and pump and other gas samples into the closed cavity In addition to the computer used for data collection and data analysis and appropriate software, this study also added an IoT module to the existing FTIR, allowing the FTIR to transmit and calculate. With the cloud, pumped FTIR's the instrument configuration is shown in **Figure 4** [18, 19]. For IoT part, this study starts with the sensor, imports the sensing signal into the electronic module, and exports the signal to the cloud system through the WiFi module, in this way, this study obtain FTIR sensing data 24 hr, and this system is set to obtain data once

The basic design of the infrared spectrometer is to emit a beam of light to the measurement area and measure the amount of intensity change after the beam passes through the gas to be tested. Since each gas molecule has its specific infrared light absorption coefficient, when a light beam passes through the measurement region, a specific gas molecule absorbs light of a specific wavelength, so that the

*Schematic diagram of instrument configuration of gas-type FTIR spectrometer.*

contribution of this research [14–16].

*DOI: http://dx.doi.org/10.5772/intechopen.92849*

**2.1 RFID and IoT technology**

quantitative [17].

per second.

**Figure 3.**

**83**

**2. Methodology and study procedure**

Treat 100,000 pieces of factory space as a large factory, that is, all machines with similar functions are only divided into a group. The layout of the machine group is planned using a typical "non-shaped" pattern (please refer **Figure 2(b)**). A FAB is divided into several rectangular blocks, and each block is called a processing area (bay). Machines in the same machine group or machines with similar functions are placed on the same bay as the principle. The bay is located on the two sides of the FAB. In the center is the among-bay goods material handling system, which is responsible for the transportation between bay and bay. Within each bay, there is also a within-bay goods material handling system, which is responsible for the machine and transport with the machine [11].

However, due to the FAB12″ 7 nm stove based on the above production management requirements, the FTIR system was installed in this study, which includes (1) confirming the characteristics of harmful process exhaust gas; (2) evaluating the processing efficiency of various process equipment process exhaust; (3) Conduct a hazard exposure assessment survey during machine maintenance and repair; (4) Confirm the concentration and source of harmful gases and particles in the clean room operating environment; (5) Identify harmful substances in the pipeline. It is intelligent with the hardware system, and the IoT module is added to the original module. In this study, various process parameters and information required by FAB are continuously obtained in the 12″ stove [12, 13].


#### **Table 2.**

*Summary of Taiwan IC manufacturing FABs.*

*Study on IoT and Big Data Analysis of 12" 7 nm Advanced Furnace Process Exhaust Gas Leakage DOI: http://dx.doi.org/10.5772/intechopen.92849*

Under this premise, in order to make the above software and hardware system intelligent, add the IoT module to the original module, so that we can continuously obtain various process parameters and information required by FAB in the 12″ furnace process tool. Through 24 hr of continuous Processing and thousands of processing machines, we will obtain a large amount of data to confirm the above production requirements, so that we can effectively master the FAB characteristics, improve production efficiency, improve product yield and establish a safe and healthy product line and employee working environment It is an important contribution of this research [14–16].
