Author details

It can be observed that the thickness map can be easily tuned up for best covering of regions where maximum heat loads occur (i.e., the nose and leading edge). Figure 7 shows the capability to create arbitrary seamless thickness distribution up to the value of the baseline thickness which has been arbitrarily set equal to thmin = 0.05 m (denoted in blue color). This corresponds to a region of the leeward surface not covered by the skin stick. Figure 7c, d shows the map of two different insulating materials created with Eq. (7). Red colors indicate material 1, which is placed on regions of the vehicle subjected to higher heat loads. Comparisons between Figure 7a, b and Figure 7c, d also exhibit the capability of the model to handle independently both the thickness and material distribution. Finally, Figure 8a, b and Figure 8c, d show the same blob distribution adopted either for thickness or material modeling applied on a different RLV configuration (RLV-2). The procedure creates, as it was expected, the same TPS distribution both for thickness or materials on two different shapes and is completely independent by

[m]; (c, d) two material map (red/blue color indicates material 1/0, respectively).

Hypersonic Vehicles - Past, Present and Future Developments

Example of thickness and material distribution over RLV configuration (RLV-2): (a, b) thickness modulation

In the present paper, a special modeling procedure of the TPS designed for a conceptual RLV has been developed. A set of macroaggregates of point source blobs organized in envelopes of finite supports, and with a bounded strength, has been successfully created on the topological map associated with the computational grid.

highlighted the sensitivity and powerful control to radically change the TPS using a

Applications of the modeling procedure to different design configurations

limited number of parameters. The promising capabilities of the developed

their morphology.

Figure 8.

7. Conclusions

26

Andrea Aprovitola, Luigi Iuspa and Antonio Viviani\* Department of Engineering, Università degli Studi della Campania "L. Vanvitelli", Aversa, Italy

\*Address all correspondence to: antonio.viviani@unicampania.it

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
