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**18** 

**Diamond, Diamond-Like Carbon (DLC) and** 

T. S. Santra1, T. K. Bhattacharyya2, P. Patel3, F. G. Tseng1 and T. K. Barik4

*4School of Applied Sciences and Humanities, Haldia Institute of Technology, Haldia,* 

Amorphous carbon films have been utilized in many types of engineering systems and adapted to fulfill a wide variety of applications. The uses of surface coatings are mainly to protect structural materials from high temperature environments or to confine the electric charge largely on interfaces between materials with differing electronic properties mainly for enormous commercial significance. Diamond, Diamond-like Carbon (DLC) and Diamond-like Nanocomposite (DLN) thin films are based on amorphous carbon films. Diamond, DLC and DLN thin films has generated a great interest in the academia due to its fundamental and technological importance. Presently, researchers have given much attention to fabricate the Micro- or Nano- electromechanical systems (MEMS/NEMS) with different types of materials. The characteristics lengths of these technologies are micrometer to nanometer range. MEMS are defined as miniature devices which combining with mechanical, electrical, optical, and biological fields to fabricate integrated circuits (IC) or other similar manufacturing devises. The applications of these MEMS technologies are in different vast areas, like biomedical, environmental, transportation, manufacturing, robotics, space sciences, computing systems etc [1-5]. Researchers have much expectation of these new frontier technologies after silicon-based microelectronic technologies. For excellent MEMS devices, the coating materials should have the properties like high hardness, high modulus of elasticity, high thermal conductivity and tensile strength, high fracture toughness, low surface roughness, very low coefficient of friction, low thermal expansion, high band gap energy, high transmission capability etc. All of these unique and attractive

**1. Introduction** 

**Diamond-Like Nanocomposite (DLN)** 

*2Department of Electronics and Electrical Communication Engineering,* 

**Thin Films for MEMS Applications** 

*1Institute of Nanoengineering and Microsystems (NEMS),* 

*Indian Institute of Technology, Kharagpur, West Bengal, 3Department of Electrical and Computer Engineering,* 

*National Tsing Hua University, Hsinchu, Taiwan* 

*University of Illinois at Urbana Champaign,* 

 *Purba Medinipur, West Bengal,* 

*1Republic of China* 

*2,4India 3USA* 

Zupan, M., & Hemker, K. J. (2002). Application of Fourier analysis to the laser based interferomteric strain/displacement gage, *Experimental Mechanics*, Vol. 42, No. 2, pp. 214-220.
