**Acknowledgements**

The support from NASA's grant, under NRA NNX11AI73A, is appreciated. The authors would like to acknowledge William Seufzer and Karen Taminger of NASA Langley Research Center for their mentorship. Support from Missouri S&T's Material Research Center, Manufacturing Engineering program, and Intelligent Systems Center is also greatly appreciated.

*New Challenges in Residual Stress Measurements and Evaluation*

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