Author details

Pingping Liu School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, China

\*Address all correspondence to: ppliu@ustb.edu.cn

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
