**Author details**

*Creep Characteristics of Engineering Materials*

RCC frame with MR damper.

**4. Conclusions**

**Figure 17.**

**Acknowledgements**

TSG/STS/2015/30-G).

decreased for RCC frame with MR damper.

*Strain versus time for with and without MR damper in RCC frame.*

strain results for with and without MR damper, 9.79% of strain was increased for

**Figure 17** shows the strain versus time curve for with and without MR damper. The RCC frame with MR damper has the stress of 0.019. On comparing the strain results for with and without MR damper, 38.09% of strain was

Finally, it is concluded, for seismic resistance, MR damper are advantageous comparing to other supplementary dampers. In the present work, the developed MR damper with the MR fluid containing magnetic nano Fe3O4 and silicone oil as the carrier liquid was studied for MR damper application. On state and off state rheology of MR fluid was studied and its damping ability was compared. However, experimental investigation shows 76% of damping force was increased for the MR damper under on-state condition. From the cyclic load test, it is proven that 49% of displacement was reduced. The smart material, nano Fe3O4 was characterized using XRD and SEM and the average size of nano Fe3O4 was calculated and found to be 12 nm respectively. The experiment results reveal, the first crack was at 6 kN for RCC frame without MR damper and at 8 kN for the frame with MR damper. The ultimate value of the specimen reaches at 17 kN for frame without damper, MR damper it reaches a maximum load carrying capacity of 37.7 kN. The ultimate load carrying capacity and energy dissipation for RC frame with damper was increased by 55 and 45% respectively on compared to the bare frame. The effects of stress, strain, displacement and load behavior with respect to time for RC element with

various time interval is observed with and without MR damper.

The authors thank the Karunya Institute of Technology and Sciences, Coimbatore, Tamil Nadu, India for their constant support. We also extend our acknowledgement to the Department of Science and Technology (Grant No: DST/

**16**

Daniel Cruze1 \*, Hemalatha Gladston1 , Sarala Loganathan1 , Tensing Dharmaraj1 and Sundar Manoharan Solomon2

1 Karunya Institute of Technology and Sciences, Coimbatore, India

2 Sathyabama Institute of Science and Technology, Chennai, India

\*Address all correspondence to: danielckarunya@gmail.com

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
