Author details

Stan T. Mandziej Advanced Materials Analysis, Enschede, The Netherlands

\*Address all correspondence to: stanamanl@cs.com

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Physical Background and Simulation of Creep in Steels DOI: http://dx.doi.org/10.5772/intechopen.89651
