**Author details**

Mario Toledo Torres\* and Nicolás Ripoll Kameid Department of Mechanical Engineering, Universidad Técnica Federico Santa María, Valparaíso, Chile

\*Address all correspondence to: mario.toledo@usm.cl

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
