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Polyimide for Electronic and Electrical Engineering Applications http://dx.doi.org/10.5772/intechopen.77597 Edited by Sombel Diaham

### Contributors

Daomin Min, Xiaoping Wang, Shengtao Li, Yan Yang, Guangning Wu, Jin Li, Boxue Du, Ranran Xu, Jiwen Xing, Janet Ho, Marshall Schroeder, Sang Youl Kim, Kunihiko Tajiri, Takahiro Muto, Didier Marty-Dessus, Laurent Berquez, Gilbert Teyssedre, Marie-Laure Locatelli, Sombel Diaham, Virginie Griseri, Flora Carrasco, Jerome Castellon, Jean Pierre Habas, Serge Agnel, Shakeel Akram, Andrea Cavallini, Tao Han, Jun-Wei Zha, George Chen, Xue-Jie Liu, Yaya Tian, Zhi-Min Dang, Baoxing Chen, Zhongfu Zhou, Wenlin Chen, Bin Chen, Hui Ding, Ying Zhang, Rao Fu, Yanya Jin, Xuejiao Sun, Jiansu Yu, Hiroaki Miyake, Yasuhiro Tanaka, Marc Abadie, Radu Dan Rusu, Sun Dal Kim,Taejoon Byun, Jin Kim, Im Sik Chung

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First published in London, United Kingdom, 2021 by IntechOpen IntechOpen is the global imprint of INTECHOPEN LIMITED, registered in England and Wales, registration number: 11086078, 5 Princes Gate Court, London, SW7 2QJ, United Kingdom Printed in Croatia

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Polyimide for Electronic and Electrical Engineering Applications Edited by Sombel Diaham p. cm. Print ISBN 978-1-83880-097-0 Online ISBN 978-1-83880-098-7 eBook (PDF) ISBN 978-1-83880-379-7
