**4. Conclusion**

This chapter has introduced polyimide materials which are now since few decades commonly used as dielectrics or insulating materials in the electronics and high voltage engineering industries for different purposes. It has been reviewed the state-of-the-art on the polyimide thermal stability. Moreover, the synthesis and imidization reactions, the main precursor monomers, the different deposition and process techniques, and the curing methods were presented. Finally, the main physical properties were summarized. This will offer a good overview as an introduction for the rest of this book.

*Polyimide for Electronic and Electrical Engineering Applications*
