**6. Concluding remarks**

The use of power electronics in a growing list of high temperature and high voltage (>500 V) applications currently requires voltage derating and/or active cooling of capacitors with state of the art polymer dielectrics (such as BOPP). High temperature polymers such as polyimides offer promising advantages over the status quo by eliminating this need for voltage derating, easing thermal management requirements, and providing a failsafe for HV applications. However, the lack of commercial interest in processing some polyimides or other specialty polymers as thin films for these comparatively niche polymer applications currently limits implementation of high temperature polymers.
