**Author details**

Chunfu Chen1 \*, Bin Li2 , Masao Kanari1 and Daoqiang Lu2

1 Henkel Technology Center-Asia Pacific, Henkel Japan Ltd., Yokohama, Japan

2 Henkel Adhesive Innovation Center, Henkel (China) Co., Ltd., Shanghai, PR China

\*Address all correspondence to: chunfu.chen@henkel.com

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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*Epoxy Adhesives*

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*DOI: http://dx.doi.org/10.5772/intechopen.86387*

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