*2.6.1 Carrier and subcarrier hybrids*

Direct specific research areas have been focused on smart damping adhesive (SDA) applications as gaskets, o-rings seals, caulks and conformal coatings [10]. One of the important concepts in creating a practical smart adhesive solution is the concept of layering films, sprays or laminate surfaces to build-up a composite solution as a smart adhesive. **Figure 12** shows an SDA pad that can thermally warm two surfaces and monitor strain between the two surfaces.

Smart adhesive layer attributes include:


Research with layers in silicone as a planar sheet, film and spray have shown test data that can provide electrical properties as follows:

#### **Figure 12.**

*Smart damping adhesives can be formed as pads, gaskets, seals, o-rings or other three dimensional shapes. Source: [11].*

**33**

as mylar.

**3. Conclusion**

your future.

**Acknowledgements**

*Evolving the Future of Smart Adhesives: Adhesives Utilizing Layers, Composites and Substrates…*

Note: utilizing various mixtures of room temperature vulcanizing (RTV)

Another important topic is the ratio mixtures for a carrier adhesive component such as Silicone (or Epoxy) is the percentage addition of sub-carrier materials such as carbon nanotube or graphene. Note: The mixing methods are currently experi-

Other carrier components include piezo particle layers for vibrational sensing, controlled frequency response and energy harvesting. Future research will incorporate embedding subcarriers of piezo particles into silicone, epoxy and plastics such

The resulting research test gaskets, o-rings and sprays exhibit consistent results

Smart Adhesives have the potential to grow into a significant industry segment of Adhesives, Coatings, bonding agents, layers and hybrid chemistry solutions that do not yet exist today. In the future it is possible that we will achieve layered adhesive solutions that can sense, monitor, communicate, and potentially self-heal. There are many uses of thermal, electrical and physical displacement that will become features in adhesives that will extend the life and functionality of the mat-

The advancements in microencapsulation, film layering, polymer research and hybrid material matrix design is moving exponentially and will likely be a part of

The research into smart adhesives is a long and continuous journey. This journey

would not be possible without the contributions and support of many people. I would like to acknowledge a few of the key people involved in this effort. Fielding Staton, CEO, Co-inventor, WINDGO, Inc.; Tony Ewen, Lead Physicist, WINDGO, Inc.; Justin Eikel, Mechanical Engineer, WINDGO, Inc.; Mason Pramod, Chemical Engineer, WINDGO, Inc.; William Whitacre, Software

Engineer, WINDGO, Inc.; Jim Kyd, Research Specialist, WINDGO, Inc.

and should have a promising future potential in the world of smart adhesives. Industries have many potential strengths to embrace by utilizing the future

silicone with carbon nanotubes the following conductivity was achieved:

• 10–20 K Ohm for pressure/strain-gauge displacement layer

mental and meant to establish proof of concept for each layer.

*DOI: http://dx.doi.org/10.5772/intechopen.85785*

Electrical layer properties (Ohms per square):

• 1 Meg Ohm for electrostatic discharge layer

• 10 Meg Ohm for optical transparency layer

• 50–2000 Ohm for thermal excitation layer

benefits of smart adhesives in the future.

ing objects as well as the adhesive itself.

**3.1 Smart adhesives summary**

Note: utilizing various mixtures of room temperature vulcanizing (RTV) silicone with carbon nanotubes the following conductivity was achieved:

Electrical layer properties (Ohms per square):


Another important topic is the ratio mixtures for a carrier adhesive component such as Silicone (or Epoxy) is the percentage addition of sub-carrier materials such as carbon nanotube or graphene. Note: The mixing methods are currently experimental and meant to establish proof of concept for each layer.

Other carrier components include piezo particle layers for vibrational sensing, controlled frequency response and energy harvesting. Future research will incorporate embedding subcarriers of piezo particles into silicone, epoxy and plastics such as mylar.

The resulting research test gaskets, o-rings and sprays exhibit consistent results and should have a promising future potential in the world of smart adhesives.

Industries have many potential strengths to embrace by utilizing the future benefits of smart adhesives in the future.
