**Author details**

David Strumpf Vice President of R&D, WINDGO, Inc., Columbia, MO USA

\*Address all correspondence to: d.strumpf@windgo.com

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

**35**

2019-03-06]

*Evolving the Future of Smart Adhesives: Adhesives Utilizing Layers, Composites and Substrates…*

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[11] Windgo, Inc., www.windgo.com.

[10] Staton F, Strumpf D. Smart Damping Adhesive II. US patent no.

Copyright 2019. Windgo, Inc

10,088,011; 2018

*DOI: http://dx.doi.org/10.5772/intechopen.85785*

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*Evolving the Future of Smart Adhesives: Adhesives Utilizing Layers, Composites and Substrates… DOI: http://dx.doi.org/10.5772/intechopen.85785*
