**Author details**

Dan Liu and Guo Hong\* Institute of Applied Physics and Materials Engineering, University of Macau, Taipa, Macau

\*Address all correspondence to: ghong@um.edu.mo

© 2019 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
