**Chapter 2**

*Lead Free Solders*

10.3390/ma9070522

2320-6349

[17] Leong YM, Haseeb ASMA. Soldering characteristics and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor aluminum addition. Materials. 2016;**9**(7):1-17. DOI:

[18] Tan AT, Tan AW, Yusof F. Influence

interfacial reactions of Sn–Ag–Cu/ Cu and Sn–Ag–Ni/Cu solder joints. Journal of Alloys and Compounds.

[25] An T, Qin F. Effects of the

2014;**54**:932-938. DOI: 10.1016/j.

[26] Benabou L, Vivet L, Tao QB, Tran NH. Microstructural effects of isothermal aging on a doped SAC solder alloy. International Journal of Materials Research. 2018;**109**(1):76-82. DOI:

[27] Kang SK, Choi WK, Yim MJ, Shih DY. Studies of the mechanical and electrical properties of lead free solder joints. Journal of Electronic Materials.

microrel.2014.01.008

10.3139/146.111578

2002;**11**(31):1292-1303

intermetallic compound microstructure on the tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joint under various strain rates. Microelectronics Reliability.

2009;**486**:142-147

of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/ Cu solder joint during different thermal conditions. Science and Technology of Advanced Materials. 2015;**16**:033505

[19] Mohammad Faizan. "Effect of inter metallic phase morphology on substrate dissolution during reflow soldering," International Journal of Mechanical Engineering and Computer Applications. 2014;**2**(2):28-32. ISSN

[20] Ghosh M, Kar A, Das SK, Ray AK. Aging characteristics of Sn-Ag eutectic solder alloy with the addition of Cu, In, and Mn. Metallurgical and Materials Transactions A. 2009;**40**(10):2369-2376

[21] Laurila T, Hurtig J, Vuorinen V, Kivilahti JK. Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers. Microelectronics Reliability. 2008;**49**(3):242-247 DOI: 10.1016/j.

[22] Chia PY, Haseeb ASMA, Mannan SH. Reactions in electrodeposited Cu/ Sn and Cu/Ni/Sn nanoscale multilayers for interconnects. Materials. 2016;**9**:430.

[23] Bui QV, Nam ND, Yoon JW, Choi DH, Kar A, Kim JG, et al. Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish. Journal of Electronic Materials. 2011;**40**(9):1937-1942

[24] Yoon J-W, Noh B-I, Kim B-K, Shur C-C, Jung S-B. Wettability and

microrel.2008.08.007

DOI: 10.3390/ma9060430

**8**
