**Table 4.**

*BiIn25Sn18 composition.*

**Figure 14.**

*X-ray record of BiIn25Sn18solder.*

#### **2.4 Results of shear strength**

**Figure 15** shows the values of shear strength of the analysed joints fabricated with SnTi2, BiIn25Sn18 and SnAg3.5Ti4(Ce,Ga) solders. The values give the average results of three measurements performed for each type of joint.

The highest strength on the copper and ceramic substrate was achieved with SnAg3.5Ti4(Ce,Ga) solder. On the Al2O3 ceramics, it attained the strength of 33 MPa, while on the copper, it was 35 MPa. In the case of this solder, the difference between the shear strength values on the side of ceramics and the copper was smallest from amongst

**37**

**Figure 16.**

*Soldering by the Active Lead-Free Tin and Bismuth-Based Solders*

all solders. The lowest shear strength values were attained with BiIn25Sn18 solder, both on the side of copper (12.2 MPa) and on the side of Al2O3 ceramics (6.6 MPa). The average shear strength values of SnTi2 solder varied within the range from 16 to 42 MPa.

**Figure 16** shows a combined soldered joint of BiIn25Sn18-Al2O3 ceramics. A longitudinal crack was observed in the interface of BiIn25Sn18-Al2O3 joint, which has occurred along the entire specimen length. This crack was formed during the metallographic preparation of specimen due to poor plastic-elastic properties of the

*Interface of Al2O3-BiIn25Sn18 joint (SEM) + concentration profiles of elements.*

*DOI: http://dx.doi.org/10.5772/intechopen.81169*

**3. Analysis of soldered joints**

solder used.

**Figure 15.**

**3.1 Analysis of Al2O3-BiIn25Sn18 joint**

*Shear strength of SnTi2, BiIn25Sn18 and SnAg3.5Ti4(Ce,Ga) solders.*

*Soldering by the Active Lead-Free Tin and Bismuth-Based Solders DOI: http://dx.doi.org/10.5772/intechopen.81169*

#### **Figure 15.**

*Lead Free Solders*

**Figure 13.**

**Table 4.**

*BiIn25Sn18 composition.*

*The BiIn25Sn18 solder (SEM).*

**2.4 Results of shear strength**

*X-ray record of BiIn25Sn18solder.*

**Figure 15** shows the values of shear strength of the analysed joints fabricated with SnTi2, BiIn25Sn18 and SnAg3.5Ti4(Ce,Ga) solders. The values give the average

**Bi [wt. %] In [wt. %] Sn [wt. %]**

A1 80.55 12.3 7.15 A2 11.7 0 88.3 A3 64.5 35.5 0

The highest strength on the copper and ceramic substrate was achieved with SnAg3.5Ti4(Ce,Ga) solder. On the Al2O3 ceramics, it attained the strength of 33 MPa, while on the copper, it was 35 MPa. In the case of this solder, the difference between the shear strength values on the side of ceramics and the copper was smallest from amongst

results of three measurements performed for each type of joint.

**36**

**Figure 14.**

*Shear strength of SnTi2, BiIn25Sn18 and SnAg3.5Ti4(Ce,Ga) solders.*

all solders. The lowest shear strength values were attained with BiIn25Sn18 solder, both on the side of copper (12.2 MPa) and on the side of Al2O3 ceramics (6.6 MPa). The average shear strength values of SnTi2 solder varied within the range from 16 to 42 MPa.
