Meet the editor

Abhijit Kar received his PhD in Chemistry-Materials Science from Jadavpur University, India. Dr. Kar carried out his postdoctoral research in different parts of the world, e.g. Sungkyunkwan University, South Korea, Swiss Federal Laboratory at Zürich, Switzerland, and as a visiting scientist at Rühr Universität, Germany. Dr. Kar has about 17 years of research and teaching experience. His current research interest comprises the application of

nanotechnology for advanced materials. He has worked on a number of similar and dissimilar materials joining methods and techniques. He is one of the first research scientists to work on lead-free solder for electronics/microelectronics applications in India. He has developed expertise on different materials characterization techniques and the mechanical and functional property evaluation of materials. Dr. Kar has published around 40 research papers in journals, edited the book *Nanoelectronics and Materials Development*, and contributed a book chapter on electron microscopy. He serves as a reviewer of many international peer-reviewed journals from Elsevier and Springer. He is editorial board member of *Journal of Materials Sciences and Applications*, *American Association for Science and Technology*, *Journal of Energy and Natural Resources*, etc.

Contents

**Preface III**

**Chapter 1 1** Introductory Chapter: Overview of Pb-Free Solders and Effect of Multilayered

**Chapter 2 9**

**Chapter 3 25**

**Chapter 4 47**

**Chapter 5 63**

Thin Film of Sn on the Lead-Free Solder Joint Interface

*by Roman Koleňák, Martin Provazník and Igor Kostolný*

*by Dattaguru Ananthapadmanaban and Arun Vasantha Geethan*

Soldering by the Active Lead-Free Tin and Bismuth-Based Solders

Room-Temperature Formation of Intermixing Layer for Adhesion

A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints *by Shuye Zhang,Tiesong Lin, Peng He and Kyung-Wook Paik*

*by Monalisa Char and Abhijit Kar*

Improvement of Cu/Glass Stacks

*by Mitsuhiro Watanabe and Eiichi Kondoh*

Role of Intermetallics in Lead-Free Alloys
