**Acknowledgements**

The author wishes to appreciate Dr. Eisuke Nishiyama and Dr. Takayuki Tanaka, Associate Professors, Saga University, Japan, for their fruitful discussions. The author also would like to thank Tasuku Uechi of Saga University, Japan, for his technical support and all the students of the Communication Engineering Lab, Saga University, Japan, for their continuous hard work.

This work was supported in part by JSPS KAKENHI Grant Numbers 26420361 and JP17K06429.

*Modulation in Electronics and Telecommunications*
