**4. Conclusions**

The electro-optics modulation capability of LiNbO3, box-sealed packaging, applications of interferometric optical sensing via electro-optic manipulating light field are firstly demonstrated here. Then, the in-fiber integration of electro-optic modulation, and the existing micro/nano fabrications for on-chip LiNbO3 waveguides are introduced. The background knowledge of LiNbO3, advantages and inferiority of different kinds of sealing method and fabrication methods are presented as reminder for near-future broad applications of EOMs. We believe the integrated EOMs, is the future of the emerging on-chip microwave photonics, quantum optics and optical communication network. The ultralow loss, high optical confinement and the ability to connect to microwave electrodes will bring electro-optic and nonlinear optical systems to a micro/nano scale, massive application that has been inaccessible until now, which deserves a better and deeper investigation.
