**Chapter 5**

*Fillers - Synthesis, Characterization and Industrial Application*

[48] Yu WY, Liu Y, Liu XY. Spreading Sn–Ag–Ti and Sn–Ag–Ti–(Al) solder droplets on the surface of porous graphite through ultrasonic vibration. Materials and Design. 2018;**150**:9-16

[49] Koleňák R, Kostolný I, Drápala J, Sahul M, Urminský J. Characterizing the soldering alloy type In-Ag-Ti and the study of direct soldering of SiC ceramics

and copper. Metals. 2018;**274**:1-17

Sn–Ag–Cu lead-free solders. In: 6th International Conference on Electronic Packaging Technology; 30 August–2 September 2005; Shenzhen, China

[39] Chang SY, Liu LC. TW Patent No.

[40] Chang SY, Liu LC. TW Patent No.

[41] Smith RW. Active solder joining of metals, ceramics and composites. Welding Journal. 2001;**10**:30-35

[42] Koleňák R, Prach M. Research of joining brittle nonmetallic materials with an active solder. Advances in Materials Science and Engineering.

[43] Koleňák R, Šebo P, Provazník M, Koleňáková M, Ulrich K. Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics. Materials and Design.

[44] Koleňák R. Soldering of Ceramic Materials. Available from: https://www. mtf.stuba.sk/buxus/docs/internetovy\_

[45] Cheng LX, Li GY, Wang XQ, Li ZL, Wu ZZ. Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce, Ga) alloy filler and Si substrate. Materials Science and Engineering A. 2016;**658**:42-49

[46] Cheng LX, Liu MR, Wang XQ, Yan BH, Li GY. Effect of active element Ti on interfacial microstructure and bonding strength of SiO2/SiO2 joins soldered using Sn3.5Ag4Ti(Ce, Ga) alloy filler. Materials Science and Engineering

[47] Smith RW, Salem A. Lead-Free Active Solder Joining in Electronic Packaging. Available from: www.

A. 2017;**680**:317-323

materialsresources.com

I322737

I511827

2014. pp. 1-9

2011;**32**:3997-4003

casopis/2009/kolenak.pdf

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