**5. Conclusions**

**Figure 14.** Microscope image of formed ferrite sheet with conductive pattern and LTCC pattern.

144 Powder Technology

**Figure 15.** Cross-sectional image of fabricated ferrite sheet with through-pattern by microscope.

**Figure 16.** Schematic illustration of the shrinking process.

In this chapter, the photoresist process was proposed. The proposed process is combined with the photolithography process and the printing process. The fine pattern for the conductor was formed by the photolithography process, because it is usually used for the production process of the IC. The printing process was used for the filling process as the conductive paste and the different material pattern.

The examples of the patterning process and the fabricated pattern were shown. In the conductor pattern, the fine pattern was formed, and the line width and thickness were 10.3 and 1.85 μm, respectively. The proposed process held the filled conductive pattern the highaspect-ratio pattern was achieved. In the ceramic pattern, the ferrite ceramic sheet that had the LTCC pattern was achieved. It was realized by using the photoresist for the mask pattern. The fabricated pattern shaped complex pattern, and the LTCC was filled into the throughpattern on the ferrite sheet completely. Moreover, the conductive paste was filled with the LTCC pattern, and then, the ceramic sheet that had three different materials was achieved. By using the proposed process, it is possible to achieve the miniature multilayer ceramic inductor that suppresses the minor loop.

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However, the patterning process combining the photoresist and material slurry showed some issues. The fabricated fine pattern was observed the thin-film conductor at the line edge. The fabricated different material pattern showed the round pattern. These problems can be solved by adjusting the viscosity and the composite ratio of the material slurry. In addition, the optimization of the type and thickness of the photoresist is required.
