**Author details**

Qi-Ye Wen1 \*, Yu-Lian He1 , Jing-Bo Liu2 , Qi Mao2 , Qing-Hui Yang1 , Zhi Chen3 and Huai-Wu Zhang1

\*Address all correspondence to: qywen@163.com

1 State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan, PR China

2 School of Electrical Engineer and Intelligentization, Dongguan University of Technology, Dongguan, Guangdong Province, PR China

3 National Key Laboratory of Science and Technology of Communication, University of Electronic Science and Technology of China, Chengdu, PR China
