**6. Conclusion**

Solution-processed functional oxide materials deposited at a plastic-compatible temperature play a central role in the emerging printed electronic devices. The chapter critically reviews recent advances in the development of low-temperature solution-processable functional oxide materials including dielectric, semiconducting, and conductive thin-film oxides for printed electronics and highlights the challenges for the fundamental understanding and practical implementation of complex oxides in devices. Properties of oxide films and devices prepared from solution-based processes at a low temperature are now approaching those of vacuum-based counterparts. In addition, ultrahigh resolution printing technologies have been introduced enabling a feasible low-cost fabrication of electronic devices on a large area without the need of sophisticated lithography and vacuum systems. The remaining challenge lies in the production of p-type semiconducting oxide thin film whose performance must be improved to reach that of the n-type counterpart. Once both n-type and p-type oxide TFTs are ready, all-oxide CMOS, a building block of many electronic devices, can be realized. Together with advanced printing technologies, it is expected that a truly printing of electronic devices has high potential to replace conventional production line in the near future.
