Author details

Aldo Figueroa Lara, Iván Rivera Islas, Víctor Hernández García, Jaziel Rojas Guadarrama and Federico Vázquez Hurtado\*

[11] Lebon G, Machrafi H, Grmela M. An extended irreversible thermodynamic modelling of size-dependent thermal conductivity of spherical nanoparticles dispersed in homogeneous media. Proceedings of the Royal Society of London. Series A. 2015;471:20150144

Thermoelectricity from Macro to Nanoscale: Wave Behaviour and Non-Local Effects

http://dx.doi.org/10.5772/intechopen.75998

59

[12] Zhou Q, Bian Z, Shakouri A. Pulsed cooling of inhomogeneous thermoelectric materials.

[13] Figueroa A, Vázquez F. Optimal performance and entropy generation transition from micro to nanoscaled thermoelectric layers. International Journal of Heat and Mass Trans-

[14] Sarra SA. Spectral methods with postprocessing for numerical hyperbolic heat transfer.

[15] Dorao SA. Simulation of thermal disturbances with finite wave speeds using a high order method. Journal of Computational and Applied Mathematics. 2009;231:637-647

[16] Ilegbusi OJ, Ümit-Coşkun A, Yener Y. Application of spectral methods to thermal analysis of nanoscale electronic devices. Numerical Heat Transfer, Part A: Applications. 2002;41:711-724

[17] Zhao S, Yedlin MJ. A new iterative chebyshev spectral method for solving the elliptic

[18] Peyret R. Spectral Methods for Incompressible Viscous Flow. 5th ed. New York: Springer;

[19] Figueroa A, Vázquez F. Spectral and finite difference solutions of the hyperbolic heat transport equations for thermoelectric thin films. Applied Mathematics. 2013;4:22-27

[20] Ezzahri Y, Shakouri A. Ballistic and diffusive transport of energy and heat in metals.

[21] Snyder GJ, Fleurial JP, Caillat T, Yang R, Chen G. Supercooling of Peltier cooler using a

[22] Gupta MP, Sayer M, Mukhopadhyay S, Kumar S. On-chip Peltier cooling using current pulse. In: 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenom-

[23] Gupta MP, Sayer M-H, Mukhopadhyay S, Kumar S. Ultrathin thermoelectric devices for on-chip Peltier Cooling. IEEE Transactions on Components, Packaging and Manufactur-

[24] Alexandrov B, Sullivan Satish Kumar O, Mukhopadhyay S. Prospects of active cooling with integrated super-lattice based thin-film thermoelectric devices for mitigating hotspot challenges in microprocessors. In: 17th Asia and South Pacific Design Automation Con-

[25] Manno M, Wang P, Bar-Cohen A. Anticipatory thermoelectric cooling of a transient Germanium hotspot. In: ASME 2013 International Technical Conference and Exhibition

equation ∇ � ð Þ¼ σ∇u f . Journal of Computational Physics. 1994;113:215-223

Journal of Physics D: Applied Physics. 2007;40:4376-4381

Numerical Heat Transfer, Part A: Applications. 2003;43:717-730

fer. 2014;71:724-731

2002

Physical Review B. 2009;79:184303

ing Technology. 2011;1:1395-1405

ference (ASP-DAC); 2012. pp. 633-638

current pulse. Journal of Applied Physics. 2002;92:1564

ena in Electronic Systems (ITherm); 2010. pp. 1-7

\*Address all correspondence to: vazquez@uaem.mx

Centro de Investigación en Ciencias, Universidad Autónoma del Estado de Morelos, Cuernavaca, Morelos, Mexico
