**MEMS Technologies Enabling the Future Wafer Test Systems Systems**

**MEMS Technologies Enabling the Future Wafer Test** 

DOI: 10.5772/intechopen.73144

Bahadir Tunaboylu and Ali M. Soydan

[4] Berka MJ, Yadid-Pecht O, Mintchev MP, Wang GMEMS. Actuator for splinter-like skin penetration in glucose-sensing applications: Design and demonstration. In: Proceedings of 2016 IEEE SENSORS; 30 October-3 November 2016. Orlando, FL, USA: IEEE; 2017.

[5] Junagal K, Meena RS. Design and simulation of microstage having PZT MEMS actuator for 3D movement. In: Proceedings of International Conference on Advances in Computing, Communications and Informatics (ICACCI); 21-24 September; Jaipur,

[6] Donald BR, Levey CG, McGray CG, Paprotny I, Rus D. An untethered, electrostatic, globally controllable MEMS micro-robot. Journal of Microelectromechanical Systems.

[7] Vogtmann D, Pierre St. R, Bergbreiter S.A 25 mg magnetically actuated microrobot walking at > 5 body lengths/sec. In: Proceedings of 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS); 22-26 January 2017; Las Vegas, NV, USA.

[8] Murthy R, Stephanou HE, Popa DO. AFAM: An articulated four axes microrobot for nanoscale applications. IEEE Transactions on Automation Science and Engineering.

[9] Elbuken C, Khamesee MB, Yavuz M. Design and implementation of a micromanipulation system using a magnetically levitated MEMS robot. IEEE/ASME Transactions on

[10] Yan G, Ye D, Zan P, Wang K, Ma G. Micro-robot for endoscope based on wireless power transfer. In: Proceedings of International Conference on Mechatronics and Automation

[11] Beeby SP, Tudor MJ, White NM. Energy harvesting vibration sources for microsystems

[12] Renaud M, Karakaya K, Sterken T, Fiorini P, Van Hoof C, Puers R. Fabrication, modelling and characterization of MEMS piezoelectric vibration harvesters. Sensors and

[13] Epstein AH, Senturia SD. Macro power from micro machinery. Science. 1997;**276**:1211.

[14] Janicek V, Husak M. Designing the 3D electrostatic microgenerator. Journal of

[15] Holmes AS, Hong G, Pullen KR. Axial-flux permanent magnet machines for micropower

[16] Herrault F, Ji CH, Allen MG. Ultraminiaturized high-speed permanent-magnet generators for milliwatt-level power generation. Journal of Micro Electro Mechanical Systems.

generation. Journal of Micro Electro Mechanical Systems. 2005;**14**:54-62

(ICMA 2007); 5-8 August 2007; Harbin, China. DOI: 10.1109/ICMA.2007.4304140

applications. Measurement Science and Technology. 2006;**17**:R175-R195

DOI: 10.1109/ICSENS.2016.7808549

188 MEMS Sensors - Design and Application

pp. 179-182

2013;**10**:276-284

Mechatronics. 2009;**14**:434-445

Actuators A: Physical. 2008;**145-146**:380-386

DOI: 10.1126/science.276.5316.1211

Electrostatics. 2013;**71**:214-219

2008;**17**:1376-1387

India. DOI: 10.1109/ICACCI.2016.7732375

2006;**15**(1):15. DOI: 10.1109/JMEMS.2005.863697

Bahadir Tunaboylu and Ali M. Soydan Additional information is available at the end of the chapter

Additional information is available at the end of the chapter

http://dx.doi.org/10.5772/intechopen.73144

#### **Abstract**

As the form factor of microelectronic systems and chips are continuing to shrink, the demand for increased connectivity and functionality shows an unabated rising trend. This is driving the evolution of technologies that requires 3D approaches for the integration of devices and system design. The 3D technology allows higher packing densities as well as shorter chip-to-chip interconnects. Micro-bump technology with through-silicon vias (TSVs) and advances in flip chip technology enable the development and manufacturing of devices at bump pitch of 14 μm or less. Silicon carrier or interposer enabling 3D chip stacking between the chip and the carrier used in packaging may also offer probing solutions by providing a bonding platform or intermediate board for a substrate or a component probe card assembly. Standard vertical probing technologies use microfabrication technologies for probes, templates and substrate-ceramic packages. Fine pitches, below 50 μm bump pitch, pose enormous challenges and microelectromechanical system (MEMS) processes are finding applications in producing springs, probes, carrier or substrate structures. In this chapter, we explore the application of MEMS-based technologies on manufacturing of advanced probe cards for probing dies with various new pad or bump structures.

**Keywords:** wafer and package test systems, MEMS technology, interconnects, interposer, wafer probes

## **1. Introduction**

Increased connectivity and functionality is driving the evolution of 2D technology toward 3D technology for integration of silicon devices and system design. This technology is becoming a scaling engine for silicon technology [1] allowing higher packing densities and shorter chip-to-chip interconnects. Shrinking die dimensions and pitch pose challenges on

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© 2016 The Author(s). Licensee InTech. This chapter is distributed under the terms of the Creative Commons

the probing and test side of the equation forces development of newer probes, interposers, interconnects and robust assembly systems [2, 3]. As 3D IC packaging is becoming mature, there is a strong push toward 3D IC Si integration. In a 3D IC integration, some of the chips, a microdisplay, microelectromechanical systems (MEMSs), memory, microprocessor, application-specific IC (ASIC), micro-controller unit, digital signal processor, microbattery and analog-to digital mixed signal are combined and stacked in three dimensions [4, 5]. These system and component level challenges are being addressed by silicon carriers or 3D-stacking, interposers, substrates and newer probe materials by MEMS processes. Developing a common intermediate board for a substrate or space transformer and probe card assembly will help solve technical challenges and reduce cost of test in both wafer and package level testing. An optimal design, which includes the IC design, the automated test equipment (ATE) test cell and the probe card solution, of the test flow between wafer sort and final test can yield benefits. Standard vertical probing technologies use microfabrication technologies for probes, templates and substrate-ceramic packages [6]. Pitches below 50 μm pose enormous challenges on fabrication of probe card components and nanotechnology and MEMS processes are required for producing probes, carrier or substrate structures for precision requirements. Probe structures must be designed with precision and their power delivery properties must be optimized. Advanced probe cards must be able to support high-speed testing and cold and hot temperature cycle testing with precision contact capability. They also need to address contact challenges for multi-row pads/bumps, full array Cu-pillar micro-bumps with various solder-bump metallurgies at temperature. Application of various technology approaches in test systems against the test requirements of silicon logic or memory or mixed signal devices is discussed.

The cost is increasing with decreasing pitch, increasing probe count and increasing parallelism. The area-array type of logic test is challenging below 100 μm bump pitch and push for MEMS type of probe solutions are required to scale with the technology. Design for tests (DFTs) with wrappers are targeted to reduce number of I/O's that need to be contacted during test. Also, the ability to reuse testers is also studied to lower the total cost of test. A test system architecture with vertical style probe card is shown is **Figure 1**. In the system, ST stands for space trans-

MEMS Technologies Enabling the Future Wafer Test Systems

http://dx.doi.org/10.5772/intechopen.73144

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When the roadmaps for probe card requirements are reviewed, there are many critical test system parameters that must be considered especially for large-sized highly parallel cards.

former, multilayer ceramic substrate (MLC) and device under test (DUT).

They are mainly:

• Controlled overdrive

• Reduced temperature drifts

• Low voltage test operation

• Less particle generation • Smart repair concepts

• Expanded temperature range

• Smart alignment features

• Cost efficiency

• Lower lead times

• Diagnostic functions on probe cards

**Figure 1.** Probe card system architecture is shown.

• Planarity self-adjustable function

• Reduced pad damage and increased uniformity
