**1. Introduction**

Introduction and application of inkjet technology, inkjet technology is involved in electronics, electrical, mechanical, materials, chemical, physics and other fields of expertise. It is highly integrated technology. Inkjet technology is in industrial applications with highspeed operation, quiet, non-contact and computer-controlled features. It does not require the use of photomask, process simplification, material utilization, low cost and more environmentally friendly. Jetting technology is a widely used technology [1–12]. The principle of ink-jet technology is mainly that the liquid in the chamber is squeezed by an Actuator

© 2016 The Author(s). Licensee InTech. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. © 2018 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

so that the liquid is squeezed by the pressure to be ejected through the spray hole. It is because each jetting hole in the ink jetting device has an independent jetting chamber, an actuator and a micron-sized jetting hole. Spray chamber can be filled with a certain amount of liquid [13–18]. When the actuator squeezes the liquid in the chamber and then passes through the micron-sized orifice, the fixed-size and uniform-size micrometer-sized liquid droplets can be jetted, as shown in **Figures 1** and **2**. This study has established a complete jet technology. For example, from the droplet nucleation and flow simulation, spray chip design, spray device package, corrosion head design, back pressure control technology, micro-droplet detection technology … and so on. It can be the most complete jet design for the technology, assembly and testing. It currently except in the relevant technology transfer to the industry outside. It also uses this technology in the display, power machinery, bio-chip, printed circuit board (PCB) and other industries in the development of new technologies.

It generates surface tension suction. It pulls the new liquid to replenish the liquid ejection area. Thermal bubble jet technology is constructed from such integrated cycle technology programs and materials.

Jet dispensing wafer technology includes high-voltage drive, low-voltage logic signal processing, and micro-electromechanical structure array. As shown in **Figure 3**. It drops a small drop of liquid onto the paper. It combines imaging with very small droplets, only 50–60 μ (micron, one millionth of a meter). It is thinner than the human hair (70 μ). The position of the drip ink is precisely finely moved by the ink head. Each inch can be up to 1000 points or more. In this research, HV-ESD Clamp was integrated into the design and fabrication of monolithic inkjet chips for multi-level output integrated circuits. It contains a high-voltage drive power device array, lowvoltage logic circuits, and micro-electromechanical components array structure integrated in a silicon substrate process. It is resistant to HBM (±4 kV), MM (±400 V) protection circuit testing.

Precisely Addressed (DNA Gene) Spray Microfluidic Chip Technology

http://dx.doi.org/10.5772/intechopen.74611

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Biomedical wafers have many advantages such as trace detection, accurate quantification, automatic operation and rapid parallel processing. Compared with traditional biomedical testing, biomedicine wafers have great advantages and so far, many breakthroughs have been made Technological development. But it cannot be denied that biomedical chips are also facing many technical challenges that need to be overcome by scientists in different fields.

As the design and manufacture of biomedical wafers are cross-cutting projects that involve the operation of microfluidic systems, biomedical reactions and optical signal detection, they are quite different from the highly specialized professional division of labor in many traditional

**2. DNA gene spray microfluidic chip technology**

**Figure 3.** Monolithic DNA liquid jet integrated ESD multi-level output.

**Figure 1.** Spray device spray diagram (top jetting).

**Figure 2.** Spray device spray diagram (side jetting).

**Figure 3.** Monolithic DNA liquid jet integrated ESD multi-level output.

so that the liquid is squeezed by the pressure to be ejected through the spray hole. It is because each jetting hole in the ink jetting device has an independent jetting chamber, an actuator and a micron-sized jetting hole. Spray chamber can be filled with a certain amount of liquid [13–18]. When the actuator squeezes the liquid in the chamber and then passes through the micron-sized orifice, the fixed-size and uniform-size micrometer-sized liquid droplets can be jetted, as shown in **Figures 1** and **2**. This study has established a complete jet technology. For example, from the droplet nucleation and flow simulation, spray chip design, spray device package, corrosion head design, back pressure control technology, micro-droplet detection technology … and so on. It can be the most complete jet design for the technology, assembly and testing. It currently except in the relevant technology transfer to the industry outside. It also uses this technology in the display, power machinery, bio-chip, printed circuit board (PCB) and other industries in the development of new

It generates surface tension suction. It pulls the new liquid to replenish the liquid ejection area. Thermal bubble jet technology is constructed from such integrated cycle technology

technologies.

202 Microfluidics and Nanofluidics

programs and materials.

**Figure 2.** Spray device spray diagram (side jetting).

**Figure 1.** Spray device spray diagram (top jetting).

Jet dispensing wafer technology includes high-voltage drive, low-voltage logic signal processing, and micro-electromechanical structure array. As shown in **Figure 3**. It drops a small drop of liquid onto the paper. It combines imaging with very small droplets, only 50–60 μ (micron, one millionth of a meter). It is thinner than the human hair (70 μ). The position of the drip ink is precisely finely moved by the ink head. Each inch can be up to 1000 points or more. In this research, HV-ESD Clamp was integrated into the design and fabrication of monolithic inkjet chips for multi-level output integrated circuits. It contains a high-voltage drive power device array, lowvoltage logic circuits, and micro-electromechanical components array structure integrated in a silicon substrate process. It is resistant to HBM (±4 kV), MM (±400 V) protection circuit testing.
