**1. General overview**

With global population rapid growth and industrialization surge, resources have reached unprecedented levels. Energy has been pointed out as the most important issue facing Humanity in the next years [1]. Energy management becomes crucial for meeting the rising

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needs of mankind [2]. Nowadays, with increasing pressure of globalized markets and companies' profit race, a dramatic search to obtain proper materials performance, optimizing components and devices designs, improving efficiencies, reducing tools wear, materials consumption and pollution, and obtaining the most possible revenue. In addition to issues regarding materials scrap, maintenance and components wear among others, a hot topic in industry is the heat dissipation. Among diverse forms of energy used, over 70% is produced in or through the form of heat [2]. Heat transfer is a crucial area of research and study in thermal engineering. Heat is transferred either to input energy into a system or to remove the energy produced in a system. Hence, reducing energy loss and intensifying heat transfer processes are becoming paramount tasks to be addressed. Therefore, thermal management plays a vital factor concerning devices, machinery or apparatuses performance; thermal transport role has been subjected to countless investigations and is under the scope of the operational useful life of these components and devices. Being this an opportunity area for successful heat management and energy efficient fluid-based heat transfer systems, with aid of reinforced materials.

Nanotechnology is a science that deals with diverse characteristics and properties of materials at a nanometric level (1 nm = 10−9 m). Recently, diverse techniques, equipment, and instrumentations have been devised, as well as various relevant and interesting characteristics and properties of these materials were sorted out. Hence, with aid of nanotechnology, with novel developments linking electronic, optical, mechanical, and magnetic properties, industrial devices have emerged, and this trend is certainly continuing in this century. Cooling of electric, electronic and mechanical devices has been a hot topic in today's fast-growing technologies. The heat required to be dissipated from systems is continually increasing due to industrial and economic trends to miniaturize designs, make better use of resources, obtain more power output, develop and use more environmentally friendly materials, and obtain more profits.
