C. The assembling:

• pre-exposure bake (soft bake) at 95C;

(Figure 20b);

ment (Figure 20d);

• integrity coils checking.

B. Manufacture of another parts:

(Figure 20e);

• dry, hard bake;

dal magnetic nanofluid—V1.

• post-expose bake at 65C and 95C, with controlled ramp;

36 Advanced Electronic Circuits - Principles, Architectures and Applications on Emerging Technologies

• exposure to UV radiation by direct writing lithography using DWL66 equipment;

Figure 20. Manufacture of a planar microtransformer with circular spiral windings with hybrid core—ferrite and colloi-

• relax and develop structures using 1-methoxy-2-propyl acetate (mr-DEV600),

• high purity copper galvanic deposition, 4, with controlled thickness (Figure 20c);

• SU8 photoresist exposed remove using free radical reaction with STP2020/R3T equip-

• controlled corrosion (remove) submicrometer layer to separate planar microcoils

• precision micromachining by CNC machine (KERN Micro) by laser ablation CompexPro/Coherent and by electrodischarge machine on SmartDEM/Kunth: sepa-

ration and sealing element, 5, (Figure 20f) and ferrite clad, 7, (Figure 20h).

