Preface

In this progressive era of mobile technology, a demand for innovative electronic devices is flourishing and nonstop. These devices thrive on multitasking and excellent performances, which can be attributed to the interconnectivity of their components. Thus, the importance of solder materials in this industry is undoubtedly higher than before. Soldering has evolved from its previous function of joining metal pieces with a fusible metal alloy to broader aspects and requirements in its applications. The wide lead-free solder characteriza‐ tion, properties, mechanism, and applications of the latest developments in solder materials are reviewed in this book. Discussion topics are based on the latest new composition of al‐ loy, updated characterization, and findings of solder joints, mechanical, and corrosion. For a full review on these topics, the reader is referred to all chapters in this book.

#### **Ahmad Azmin Mohamad**

Lecturer in Materials Engineering Program School of Materials and Mineral Resources Engineering Universiti Sains Malaysia Nibong Tebal Penang, Malaysia

**Provisional chapter**
