**Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound Metallic Materials with Application of Active Solders and Power Ultrasound**

**Recent Advances in Solderability of Ceramic and** 

DOI: 10.5772/intechopen.69552

Roman Koleňák Additional information is available at the end of the chapter

Roman Koleňák

Additional information is available at the end of the chapter

http://dx.doi.org/10.5772/intechopen.69552

#### **Abstract**

The Chapter deals with solderability of ceramic materials by ultrasound and suitable selection of soldering alloy. The solderability issue of ceramic materials consists mainly in the fact that the ceramic materials are not wettable by the common solders, due to their ionic and covalent bond between the atoms. However, there exist several ways to ensure the wettability of ceramic material surface. One of them is for example coating of ceramic material by a metallic layer. Anyway, a more perspective solution seems to be the application of soldering alloys which are alloyed with a small amount of alloying elements which exert high affinity to some component of ceramic material. The basic group of such solders are the so-called active solders containing from 1 to 5 wt. % Ti. Another group of solders, which may wet the ceramic material, are the solders alloyed with a small amount of lanthanides, for example La, Ce etc. The content of lanthanides varies from 0.5 up to 2 wt. %. The last group consists of the solders containing indium in the amount from 20 to 100 wt. %. The aim of study was to compare these three groups of soldering alloys from the viewpoint of mechanism of bond formation. The interactions between the solder and ceramic substrate were analysed and shear strength of fabricated soldered joint was determined. To improve the solderability, the soldering in combination with an active power ultrasound was also employed.

**Keywords:** solder, active solder, metallic materials, ceramic materials, ultrasonic soldering, wetting, shear strength, tin, indium, lanthanum, EDX analysis
