**Introductory Chapter: Overview of Recent Progress in Soldering Materials Soldering Materials**

**Introductory Chapter: Overview of Recent Progress in** 

DOI: 10.5772/intechopen.69764

Ahmad Azmin Mohamad Ahmad Azmin Mohamad

Additional information is available at the end of the chapter Additional information is available at the end of the chapter

http://dx.doi.org/10.5772/intechopen.69764

**1. Introduction**

Sn‐Pb solders have a long history and are widely used in the electronics industry due to their low cost, good solderability, low melting temperature and satisfactory mechanical properties. However, due to recent legislation and market pressures, Pb is being removed from electronic products [1].

Many lead‐free solders have been studied as replacements for Sn‐Pb solders. Of these, Sn‐Ag‐Cu‐ based materials are the most promising candidates owing to their overall properties, including mechanical and reflow properties, wettability and reliability.

Nowadays, electronic devices have become smaller and more complicated. However, the reli‐ ability of soldered components remains a critical issue. The need for high electric current den‐ sity and the decreasing scale of solder‐substrate interfaces of the latest advanced electronic products are everyday challenges for those in solder‐related industries.

This book concerns solders and focuses on material characterizations, solder composition, and the methods used to make alloys and determine their structures, physical properties and applications. Physical properties, the factors that control them, and theoretical verifica‐ tion are key elements of solder research and will be reviewed in detail. Corrosion of solders is included in the coverage of the properties related to solder composition and mechanical properties.
