**2.6. High-temperature activation**

It is a process being performed at high temperature (850–950°C), mostly in vacuum furnace with the shielding atmosphere of argon as shown in **Figure 5**. It was found out experimentally that at activation with Ti-active element, the lowest temperature at which wetting of Al2 O3 ceramics may be achieved is 780°C. However, wetting depends also on the content of Ti-active element in the solder [7].

With increasing soldering temperature (activation temperature), the wetting of ceramic material is enhanced by high-temperature activation but, in contrary, if a ceramic material is soldered in combination with metallic material, the degradation of base metal by erosion may occur.
