**6. Summary**

Development of hybrid and electric vehicles (HEV/EV) has brought challenges to power semiconductor industry in automotive power module packaging. As the essential role of power module plays in HEV/EV power-train system, people have made great efforts to improve electrical and thermal performance, reliability, volume/weight, and cost of automo‐ tive module. Many innovative designs in power module structure, material, and assembly technology have been proposed based on conventional power module packaging.

In this chapter, the status and trend of automotive standard power module packaging are reported. We have discussed the importance and functionality of power electronics and module in HEV/EV power-train system, and summarized the performance requirements by automotive industry. The designs of structure, material, and packaging technologies for high thermal, electrical performance, and high reliability for HEV/EV module are investigated. An overview of the typical state-of-the-art commercial and custom HEV/EV power modules, including direct liquid cooled, baseplate, and solder free, direct lead bonded, planar intercon‐ nection and double-sided cooled, are analyzed. The details of novel structures, advanced packaging materials, and trends of assembly technology are proposed to instruct automotive module designs.
