**Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles**

Yangang Wang, Xiaoping Dai, Guoyou Liu, Yibo Wu, Yun Li and Steve Jones

Additional information is available at the end of the chapter

http://dx.doi.org/10.5772/64173

#### **Abstract**

**Author details**

**References**

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\*Address all correspondence to: bogdan.varga@auto.utcluj.ro

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University of Cluj‐Napoca, Cluj‐Napoca, Romania

2222 Modeling and Simulation for Electric Vehicle Applications

, Dan Moldovanu, Florin Mariaşiu and Călin Doru Iclodean

Automotive Engineering and Transport Department, Faculty of Mechanics, Technical

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Power semiconductor modules are the core components in power-train system of hybrid and electric vehicles (HEV/EV). With the global interests and efforts to popularize HEV/EV, automotive module has become one of the fast growing sectors of power semiconductor industry. However, the comprehensive requirements in power, frequency, efficiency, robustness, reliability, weight, volume, and cost of automotive module are stringent than industrial products due to extremely high standards of vehicle safety and harsh environment. The development of automotive power module is facing comprehensive challenges in designing of structure, material, and assembly technology. In this chapter, the status and trend of power semiconductor module packaging for HEV/EV are investigated. Firstly, the functionality of power electronics and module in HEV/EV power-train system, as well as the performance requirements by automotive industry, is addressed. A general overview of HEV/EV module design and manufacturing is discussed. Then, the typical state-of-the-art commercial and custom HEV/EV power modules are reviewed and evaluated. Lastly, the packaging trends of automotive module are investigated. The advanced assembly concept and technology are beneficial to thermal management, minimized parasitic parameters, enhancement of thermal and mechanical reliability, and the reduction of weight, volume, and cost.

**Keywords:** hybrid and electric vehicles, insulated gate bipolar transistor, packaging, power module, reliability

© 2016 The Author(s). Licensee InTech. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
