**Author details**

and copper bonding wire are developed for enhancing reliability and lifetime of automotive

The new housing materials are applied in injection molding, transfer molding, and hematic supply high temperature and high mechanical reliability, which are becoming the mainstream

The assembly technology is essential to power module performance and reliability, so advanced joining and interconnection technologies are being developed for automotive packaging. The trends of joining interfaces between die, substrate, and baseplate are high and stable tensile strength solder layer formed by SnSb, high temperature and reliability interme‐ tallic solder layer formed by transient liquid phase sintering (TPLS), or superior silver-sintered layer. SnSb soldering is an easy and cost-effective way by traditional process; however, TPLS

The conventional Al wire bonding interconnection technique will be replaced by copper wire bonding and planar contacts such as direct lead and flexible PCB bonding. Copper wire bonding improves current and thermal capability, and the reliability, which the planar packaging results in high current, low parasitics, low loss, uniform temperature, and high

The interconnection of bus bar and pin is usually soldered to substrate in an industrial power module, which have low thermal and mechanical reliability. Recently, ultrasonic welding, which results in quite high bonding strength and pressure contact, is proposed in automotive power packaging. Both enhance thermal and mechanical reliability significantly by eliminat‐

Development of hybrid and electric vehicles (HEV/EV) has brought challenges to power semiconductor industry in automotive power module packaging. As the essential role of power module plays in HEV/EV power-train system, people have made great efforts to improve electrical and thermal performance, reliability, volume/weight, and cost of automo‐ tive module. Many innovative designs in power module structure, material, and assembly

In this chapter, the status and trend of automotive standard power module packaging are reported. We have discussed the importance and functionality of power electronics and module in HEV/EV power-train system, and summarized the performance requirements by automotive industry. The designs of structure, material, and packaging technologies for high thermal, electrical performance, and high reliability for HEV/EV module are investigated. An overview of the typical state-of-the-art commercial and custom HEV/EV power modules, including direct liquid cooled, baseplate, and solder free, direct lead bonded, planar intercon‐

technology have been proposed based on conventional power module packaging.

module.

reliability.

ing interface layers.

**6. Summary**

housing of automotive module.

**5.3. The trend of assembly technology**

42 Modeling and Simulation for Electric Vehicle Applications

and silver sintering have more reliability benefits.

Yangang Wang1,2\*, Xiaoping Dai1,2, Guoyou Liu1,2, Yibo Wu1,2, Yun Li1,2 and Steve Jones1,2

\*Address all correspondence to: yangang\_wang@dynexsemi.com

1 Power Semiconductor R&D Centre, Dynex Semiconductor Ltd, CRRC Times Electric co. Ltd, Lincoln, UK

2 State Key Laboratory of Advanced Power Semiconductor Devices, CRRC Times Electric co. Ltd, Shifeng District, Zhuzhou, Hunan, P. R. China
