Preface

Recent developments in electronics and semiconductor technologies and the continued min‐ iaturization have resulted in very high increase in power density for high performance chips and devices. Although impressive progress has been made during the past decades, there remain serious technical challenges in thermal management of electronic devices as the con‐ ventional cooling approaches are increasingly falling short in meeting the ever-increasing cooling demand of high-heat flux generating electronics.

Featuring contributions from internationally renowned academics and researchers in the field, this book covers various key electronics cooling approaches, including conventional and advanced ones.

This book starts with an introductory chapter overviewing available conventional and emerging cooling methods as well as coolants such as nanofluids for electronics cooling.

The second chapter introduces an innovative cooling method using boiling heat transfer to immiscible liquid mixtures and also presents and discusses experimental findings.

The third chapter covers the knowledge and state-of-art technologies in regard to heat pipe and phase change heat transfer, which are very essential for reliable operation of ultra-high heat flux generating electronic devices.

The fourth chapter presents application of heat pipe systems for computer cooling. It also reviews studies on the types of heat pipes and their applications in electronics cooling par‐ ticularly computer cooling.

The fifth chapter presents the operating principles, heat transfer characteristics, and fabrica‐ tion process of MEMS-based micro-grooved heat pipes and further reports some promising and innovatory applications of MEMS-based micro heat pipes.

The sixth chapter presents an extensive numerical study on the performance evaluation of laminar mixed convection heat transfer of nanofluids and microchannel for the electronics cooling application.

The seventh chapter provides insight into experimental, numerical, and analytical studies on the reciprocating-mechanism driven heat loop (RMDHL) cooling technology for power electronic systems. This chapter also clarifies the fundamental physics behind the working mechanism of RMDHLs and derives a working criterion as guidance for the design of a RMDHL.

The final chapter pertains to the theoretical derivation for the estimation of the junction tem‐ perature of package chip, which is very important in order to design any integrated circuit.

This book is intended to be a useful source and guide to researchers, engineers, postgradu‐ ate students, and academics in the fields of thermal management and cooling technologies as well as for people working in the electronics and semiconductors industries.

I would like to thank all the authors for their high-quality contributions and the staffs from the publisher for providing continuous support, which have made possible the successful and timely completion of this book.

This book is dedicated to my wife Romana Afroz for her unconditional love, constant sup‐ port, and selfless care.

> **S M Sohel Murshed** University of Lisbon Lisbon, Portugal
