**1. Introduction**

The electroplating method can be used to produce composite coatings by adding particles in the metal plating bath. The particles are trapped in the coating during deposition. Composite

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coatings are composed of an electrodeposited metal matrix and dispersed solid particles. The metal powders, metal alloy powders and metal oxide powders of Al, Co, Cu, In, Mg, Ni, Si, Sn, V, Zn and nitrides of Al, B, Si and C (graphite or diamond) and carbides of B, Bi, Si, W and MoS2 and organic materials such as polytetrafluoroethylene (PTFE) and polymer spheres are used as the particles [40].

The main application areas of the composite deposition are electronic, biomedical, telecom‐ munication, automotive, space and consumer applications where high strength, equiaxed micro-components are required.

The electroplating parameters must be controlled during electrodeposition since they have significant effect on the coating properties, deposition efficiency and hydrogen evolution. Besides the current density, pH of the bath, bath temperature that places among the main electroplating parameters [36], there are more parameters including the type, the size, the concentration of the particles [37] and the addition of surfactants and their types [20]. The main properties of the coating can be listed as the corrosion resistance in TiO2 – nickel coating [38], tribological properties in MoS2 – nickel coating [4], mechanical properties in TiO2 – nickel coating [38], internal stress in MoS2 – nickel coating [9], texture in chromium – carbon deposit [39], particle content of the deposit [24] are severely affected by the electroplating parameters.

The aim of this chapter is to emphasize on the electroplating parameters, their effects and interaction effect on the coating properties. Particle incorporation in the deposit is an important property that must be analysed since composite electroplating aroused in order to improve the matrix properties with particle addition. Another important property is the internal stress that must kept at minimum levels not to disrupt the deposit.
