*3.1.1. Guglielmi model*

**3. Pulse co- electrodeposition of Sn based composites**

**Sn-Pb reinforced with Cu and**

256 Electrodeposition of Composite Materials

**Sn-Cu reinforced withAl2O3**

**Sn-Bi reinforced with SiC**

**Sn-Bi reinforced with Yttrium**

**Sn-Ag reinforced with ZrO2**

**Sn-Ag reinforced with Cu6Sn5, Ni3Sn4, FeSn2 nanoparticles**

**Sn-Ag reinforced with CeO2**

**Sn-Ag-Cu reinforced with SiC**

**Sn-Ag-Cu reinforced with TiO2**

**Sn-Ag-Cu reinforced with TiB2**

**Table 1.** Nanocomposite solder produced by various routes

**Sn-Ag-Cu reinforced with**

**Sn-Ag reinforced with**

Initially, the pulse electrodeposition was used for decorative and jewellery applications to improve the surface appearance and shine, wear and friction, fretting corrosion resistance.[42] Recently, more attention has been paid to incorporate different nanoparticles to obtain much improved properties. There are various processing parameters in electrodeposition that affect the particle incorporation in composite deposits, such as (1) particle type, size, and shape; (2) bath pH, constituents, additives, and aging; (3) deposition variables, such as particle concen‐

tration in bath, current density, agitation, pulsing methods, and temperature.[42–44]

**TiO2 nanoparticles** Blending and solidification Improved microhardness [47]

**Sn-Cu reinforced with Si3N4** Powder Metallurgy Improved wetting [48]

**nanoparticles** Electro Deposition Improved shear properties [38]

**oxide nanoparticles** Powder Metallurgy Improved shear strength [33]

**nanoparticles** Pulse electroplating Whisker resistant [41]

**nanoparticles** Powder Metallurgy Improved mechanical

**nanoparticles** Casting and solidification Improved mechanical

**SnO2 nanoparticles** Powder Metallurgy Improved mechanical

**nanoparticles** Mixing and solidifying Improved mechanical

**Multiwalled CNT** Powder Metallurgy Improved mechanical

**nanoparticles** Melting route Improved mechanical

**nanoparticles** Powder Metallurgy Improved mechanical

**Composite system Methodology Improved properties Reference Sn-reinforced with CNT** Electrodeposition Improved shear properties [37]

performance [21]

performance [22]

performance [25]

performance [22]

performance [34]

performance [23]

performance [49]

In situ methods Creep resistant [46]

The first step involves the loose adsorption of the particles onto the electrode surface. This is a physical adsorption process. However, in the second step, the particles are attracted towards the electrode under electric field and causes a stronger adsorption of particles onto the electrode, as shown in Fig. 2.

**Figure 2.** Codeposition mechanism into a metal matrix.[50, 51]

As a result of strong adsorption, the particles are incorporated in the deposit and form a composite layer. This model is the simplest and is adopted for various composite systems, however, it does not account for hydrodynamic effects, particle size, type and shape in detail.
