**4.7. Plating mode**

Various electrodeposition modes utilizing pulsing waveforms like pulsed current (PC), pulsed reverse current, and DC have been used to improve the embedded particles density into composite matrix.[87] The application of PC technique in nickel electroplating has been shown to improve mechanical properties, wear and friction, and more uniform distribution of the particles compared to DC technique.[77]

At a given average current density, a decrease in *t*on time induces a fine crystallite size and increases nucleation rate have been reported.[88] In addition, a longer *t*off promotes the grain growth and the arrival of more particles near the cathode. Therefore, pulse plating is impor‐ tant for co-electrodeposition of nanocomposites. For example, in Ni–SiC deposition, the applicationofPCresultsintheproductionofcompositecoatingswithhigherfractionofparticles, andbetterpropertiesthanobtainedwithDCplating.[89]Inanothertechniqueofpulsereversing, the pulsed-reverse current (PRC) technique, a stripping time is also applied to the pulse waveform, during which the surface projections are dissolved and produce more smooth deposit.[90] The Zn matrix nanocomposite reinforced with the TiO2 nanoparticles using the PRCtechniquehasbeenshowntoimprovetheembeddedTiO2particledensityinthematrix.[91]
