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252 Electrodeposition of Composite Materials

209-214.

This chapter provides a detailed overview of the various Sn-based composites solders re‐ inforced with ceramic nanoparticles. These solders are lead free in nature and are pro‐ duced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodepos‐ ited composite solders, their synthesis, characterization, and evaluation of various prop‐ erties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electri‐ cal resistivity, and residual stress of the monolithic Sn-based and (nano)composite sol‐ ders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in sol‐ der matrix, the pulse co-electrodeposition technique, the various factors affecting compo‐ site deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

**Keywords:** Composite, lead free, plating, double layer, zeta potential
