Chapter 7 **Ice Recrystallization Inhibitors: From Biological Antifreezes to Small Molecules 177**

Chantelle J. Capicciotti, Malay Doshi and Robert N. Ben

Preface

mation can act as nuclei.

curring during deformation.

Recrystallization is a phenomenon that is moderately well documented in the geological and metallurgical literature. This book provides a timely overview of the latest research and methods in a variety of fields where recrystallization is studied and is an important factor. Perhaps the main advantage of a new look at these fields is the rapid increase in modern techniques, such as TEM, spectrometers and modeling capabilities which are providing us

Section 1 includes two chapters giving a general overview of state of the art in research and techniques involving recrystallization. In Chapter 1 Lee and Han discuss the process where‐ by recrystallization takes place through nucleation and growth. Nucleation during recrystal‐ lization can be defined as the formation of strain-free crystals, in a high energy matrix, that are able to grow under energy release by a movement of high-angle grain boundaries. They argue though that the definition is broad and that crystallization of amorphous materials is called recrystallization by some people and can be confused with the abnormal grain growth. They present a theory which is able to determine whether grains surviving defor‐

In Chapter 2 Quan gives us an overview of microstructures of alloys and grain boundary migration. Metals and alloys have properties of importance including high strength, rela‐ tively good ductility and good corrosion resistance. The author describes how optimization of the thermo-mechanical process can be achieved through an understanding of the entire forming process and the metallurgical variables affecting the micro-structural features oc‐

He concludes that at a fixed temperature, as deformation strain rate increases, the micro‐ structure of the billet becomes more and more refined due to increasing migration energy

Section 2 consists of a variety of chapters generally related to recrystallization in metals and alloys. In Chapter 3 Li et al. look at solder joints from the perspective of recrystallization. Solder alloys are widely used bonding materials in the electronics industry and issues with reliability for solder interconnections are rising, with the increasing use of highly integrated components in portable electronic products. They discuss how recrystallization is a source

In Chapter 4 Gepreel gives an in-depth look at β-type titanium alloys. Typically they have high strength, low density, good cold-workability, heat treatability and corrosion resistance. In this chapter, results from studies of different groups of β-type Ti-alloys with different lev‐ el of β-phase stability containing different alloying elements are discussed. A strategy to de‐

with far better images and analysis than ever previously possible.

stored in grain boundaries and decreasing grain growth time.

of deformation and thermomechanical stress in the solder interconnection.
