Preface

Nanotechnology has experienced a rapid growth in the past decade, mostly because of the rapid advances in nano-fabrication techniques employed to fabricate the nanodevices. Nano-fabrication can be divided into two categories: the first is the so-called "bottom up" approach, in which nano-structures are created either by chemical synthesis of nano-wires, nanotubes and nano-particles, or by self-assembly of nano-objects or thin layers to form quasi-periodic arrays or phase separation patterns. The second category is the "top down" approach, where nano-structures are created or duplicated from a master mask or mold, using nano-lithography, thin film deposition and etching techniques. Both topics are covered, though with a focus on the second category.

This book aims to provide the fundamentals and the recent advances of nanofabrication techniques and its device applications. The thirty chapters are a result of contributions from roughly 100 researchers worldwide. Most chapters focus on indepth studies of a particular research field, and are thus targeted for researchers, though some chapters focus on the basics of lithographic techniques accessible for upper year undergraduate students.

The chapters are divided into five parts. Part I covers lithography based on charged beam, namely electron and focused ion beam lithography, which are the most popular nano-lithographies for R&D. Part II focuses on nano-imprint and soft lithography, which duplicate in parallel a pattern on the mold into a resist layer, and thus have high throughput making them suitable for volume production of nano-devices. Part III contains information on several lithographies using light (UV and X-ray) other than conventional optical lithography. Part IV deals with lithographic techniques relevant only to the next generation integrated circuit fabrication, including extreme UV and deep UV lithography with resolution enhancement techniques. All other lithographic techniques, both bottom up and top down, are grouped in Part V.

In conclusion, I would like to express my sincere gratitude to the contributing authors of each chapter, as well as the publishing process manager, Ms Alenka Urbancic, who spent tremendous time in communicating with me and the authors.

> **Bo Cui**  University of Waterloo Canada

**Part 1** 

**Electron and Ion Beam Lithography** 
