**6. Conclusion**

This chapter has reviewed liquid encapsulation technologies and their applications to the manufacture of innovative MEMS devices that exploit the useful characteristics of liquid; liquid is deformable and liquid droplets form a perfectly spherical shape by surface tension. Other liquids have high relative dielectric constants. Liquids can be used as drugs for DDS and fuels for power MEMS. Appropriate liquid encapsulation technologies must be selected according to the liquid to be encapsulated. The fill and seal approach, bonding-in-liquid technique, and direct deposition of a thin film were discussed in this chapter, all of which have both advantages and disadvantages.

The use of liquid in MEMS packaging is quite a new technology. The author is convinced that more and more liquid encapsulation technologies will be developed and contribute to the further development of innovative liquid-encapsulating MEMS devices.
