**9. Reliability requirements**

For application in optical networks, modules must be stable with respect to temperature changes and mechanical stresses. At present, there are several definite environmental and mechanical criteria for optical devices such as sensor and transmitter modules., which are investigated with reference to the [20] requirements. In the tests, insertion losses were meas‐ ured online for each sample.

**Figure 28.** Temperature cycle test structure.

Temperature stress can be invoked into the modules by cycling the environmental tempera‐ ture between a high temperature called TA and a low temperature TB that is depicted in figure 28. Additionally, relative air humidity can be increased up to 80 % or 95. The follow‐ ing institutions have developed the commonly used testing standards:



**Table 4.** Environmental test parameters.

**Figure 27.** Arrayed waveguide grating module [19].

For application in optical networks, modules must be stable with respect to temperature changes and mechanical stresses. At present, there are several definite environmental and mechanical criteria for optical devices such as sensor and transmitter modules., which are investigated with reference to the [20] requirements. In the tests, insertion losses were meas‐

Temperature stress can be invoked into the modules by cycling the environmental tempera‐ ture between a high temperature called TA and a low temperature TB that is depicted in

**9. Reliability requirements**

438 Optoelectronics - Advanced Materials and Devices

ured online for each sample.

**Figure 28.** Temperature cycle test structure.

**Figure 29.** Environmental test set-up.

A typical set-up used for temperature testing is depicted in figure 29. Further, the device un‐ der test (DUT) is placed into a humidity controlled environmental test chamber. The tem‐ perature behavior of the opto-electronic module is mostly characterized by measuring the variation of optical output power. A plot of a typical temperature test between +15°C and +40°C is shown in figure 30. The temperature behavior of a laser module shows a maximum output variation of ±0.15 dB with temperature which is a real good result. Three cycles with‐ in 4 hours of measuring time were performed with temperature controlling of the OEIC shown in figure 30.

IEC-standards-shop http://www.iec-normen.de

Telcordiahttp://www.telecom-info.telcordia.com

typing in laboratory environmentand high volume production.

Address all correspondence to: ufischerhirchert@hs-harz.de

Harz University of Applied Sciences Friedrichstraße, Wernigerode

[1] Fischer, U. (2002). *Optoelectronic Packaging*, Berlin, VDE Verlag.

[2] Wild, T., & Stremitzer, S. (2007). *Digitale Wundanalyse mit W.H.A.T. (Wound Healing*

[4] Homepage Aufbau- und Verbindungstechnik im HHI. Available, http://www.hhi.de/

[5] Siegmund, S., Fischer-Hirchert, U. H. P., & Bauer, A. (2012). Technikgestützte Pflege-Assistenzsysteme und rehabilitativ-soziale Integration unter dem starken demografi‐

[6] Reinboth, C., Fischer-Hirchert, U. H. P., & Witczak, U. (2012). Berlin. Technische As‐ sistenzsysteme zur Unterstützung von Pflege und selbst-bestimmtem Leben im Al‐

[3] http://www.mostnet.de, Available, http://www.mostnet.de/home/index.html.

schen Wandel in Sachsen-Anhalt. Berlin. *in 5. Deutscher AAL-Kongress*.

ter- das ZIM-NEMO-Netzwerk TECLA, *in 5. Deutscher AAL-Kongress*.

We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling for single mode and multimode fibers with simultaneous coupling of both chip sides by a new-patented set-up. Additional, we created passive and active modules with temperature control and multi fiber connections up to 16 fibers via fiber arrays. The mod‐ ules have been tested in a reliability stress program between -40° C and +80°C and by a vi‐ bration shaker. Electrical modulation signals up to 50 GHz can be fed via RF connectors to the OEIC. The packages show good long-term stability and are well suited for rapid proto‐

Opto-Electronic Packaging http://dx.doi.org/10.5772/51626 441

**10. Conclusion**

**Author details**

Ulrich H. P. Fischer\*

**References**

avt.

*Analyzing Tool)*.

After thermal cycling, the test for mechanical shock and vibration stress was completed. Me‐ chanical shock tests must be performed in all three Cartesian directions. The measured ac‐ celerations amounted to more than 200 g within 3 ms. The vibration tests where performed by a so called "shaker machine". The excitation of the module was measured with an accel‐ eration sensor and a digital oscilloscope. The acceleration was controlled to be stronger than 16 g within a broad spectral bandwidth of 50-5000 Hz. Several tests figures can be run with the so called "shaker machine":


To reach a certified test label for opto-electronic modules according to the Telcordia specifi‐ cations, eleven modules must undergo the environmental and mechanical stress test. None of the tested specimens is allowed to show a failure. The strong requirements for the test procedures are only achieved by substantial preliminary testing of the modules.

**Figure 30.** Temperature test of the laser module between -15°C and 50°C.

*Sources of supply for environmental standard tests-*VDE-Verlag http://www.vde-verlag.de DIN http://www.din.de

IEC-standards-shop http://www.iec-normen.de

Telcordiahttp://www.telecom-info.telcordia.com
