**3. VLSI Relocation problem using MFA technique**

In modern VLSI physical design, Engineering Change Order (ECO) optimization methods are used to mitigate model placement problems such as hot spots and thermal dissipation that are identified at a given layout at post-routing analysis that is an evaluation stage after placement stage. The relocation problem is defined as adding an additional module to a model placement in order to solve problems at a manner that similarity of the resultant placement to the model placement is kept.

Our presented MFA-based technique is modified form which was applied for cell placement problem in [14] by adding some considerations relating to particular characteristics of the local relocation problem.
