**Three-Dimensional Integrated Circuits Design for Thousand-Core Processors: From Aspect of Thermal Management**

Chiao-Ling Lung1,2, Jui-Hung Chien2, Yung-Fa Chou2, Ding-Ming Kwai2 and Shih-Chieh Chang1

*1Department of Computer Science, National Tsing Hua University 2Information and Communications Research Laboratories, Industrial Technology Research Institute Taiwan* 
