**7. Summary and future work**

220 VLSI Design

Through-Silicon-Via (TSV) is a cylindrical metallic structure that is assumed to be used for power/signal distribution in a three-dimensional (3D) stack of dies. It has dielectric layer around it and normally passes through the Si-substrate in vertical direction. Figure 5 shows the cross section of a Si-Substrate with MOSFET transistor and TSV. Part of the Signal/logic switching transition though TSV can cross-through the barrier layer and may pass through the substrate and impact the performance of neighboring active devices and TSVs, known as TSV induced noise. It depends on TSV to device distance and substrate contacts. The transitions through TSVs may vary the body voltage VB of the MOSFET device. TSVs-

**6. TSV-induced substrate noise in 3D integrated circuits** 

induced substrate noise is almost directly related to the density of TSVs.

dTSV

GND tie

dgt

VTSV

tliner

Dielectric liner

Fig. 5. Cross-section view of TSV-to-device coupling (Khan, 2009, 2011).

short lived with only 50ps transition time.

2011).

Figure 6 shows variations in the MOSFET device body voltage, VB, for different distances from a TSV for the set of design parameters shown by this Figure. The transitions are very

Si Substrate

VB

hTSV

Fig. 6. Body voltage during TSV signal transition at different distances, dTSV , for VTSV=1V square wave, hTSV=20um, tliner=1um, dgt=0.5um, signal transition time=50ps (Khan, 2009,

On-chip switching noise for a three-dimensional (3D) power distribution network has deleterious effects on power distribution network itself as well the active devices. The extent of switching noise is related to the TSV density on one hand, whereas the integration density of on-chip devices on the other hand. Peaks of the switching noise largely depend on effective inductance of the power distribution network at high frequencies of the order of GHz. Therefore, efficient implementation of on-chip decoupling capacitance along with other on-chip inductance reduction techniques at high frequency is necessary to overcome the switching noise. In addition to that some accurate and efficient modeling techniques are also necessary for early estimation of the switching noise in order to lay down the rest of the design parameters for a three-dimensional (3D) power distribution network.

### **8. Acknowledgment**

The author would like to acknowledge European Union research funding under grant FP7- ICT-215030 (ELITE) of the 7th framework program and Higher Education Commission (HEC), Pakistan, for the support of this work.

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**11** 

*Mexico* 

**Low Cost Prototype of an Outdoor Dual** 

M. Tecpoyotl-Torres1, J. A. Damián Morales1, J. G. Vera Dimas1,

*1Centro de Investigación en Ingeniería y Ciencias Aplicadas (CIICAp-UAEM)* 

In this research, we developed a dual antenna array for the household reception of openly analogical television (TV) frequencies. This array was designed on Flame Retardant-4 (FR-4)

The interest in this area is because of the fact that the openly TV is one of the most important communication media in our country. From information supplied in 2009 in the National Survey over availability and use of Technologies, it reveals that the 72.8% of the population uses the services of the openly TV (Instituto Nacional de Estadística, Geografía e Informática [INEGI], 2009). A TV can be found in almost all homes of the country, but only 13.6% correspond to digital technology, while only a half of homes with a digital TV requires signal payment. The availability of TVs in Mexican homes in 2010 remained without severe

Since the operation frequencies ranges are not so high, and then the antenna sizes, obtained directly from the design equations are very large. Therefore, the scaling is a necessary step

As it is well-known, a very simple common example of antennas used for household reception of TV is the Yagi-Uda (or Yagi) array, where the length of the dipoles established the phase of the individually received signals. An example of a commercial Yagi-Uda antenna designed for channels 2-13 can be found in (Balanis, 2005). The TV transmission has the polarization vector in the horizontal plane so that the array must also be horizontal

The evolution of the antennas designed in order to improve the openly TV reception has notably changed in the last years, in such a way, for outdoor use it is possible to find the large aerial antennas, fixed or with an integrated rotor, under different geometries, such as

in order to reduce the antenna sizes to achieve its easy manipulation.

**1. Introduction** 

changes (INEGI, 2010).

(Melissinos, 1990).

as substrate, in order to obtain a low cost prototype.

**Patch Antenna Array for the Openly** 

**TV Frequency Ranges in Mexico** 

*2Facultad de Ciencias Químicas e Ingeniería (FCQeI-UAEM)* 

R. Cabello Ruiz1, J. Escobedo-Alatorre1, C. A. Castillo-Milián2 and R. Vargas-Bernal3

*3Instituto Tecnológico Superior de Irapuato (ITESI)* 

*Proceedings of Design, Automation and Test in Europe Conference,* pp. 1078-1083, Paris, France, March 2004

