**4. Conclusion**

148 Power Quality Harmonics Analysis and Real Measurements Data

Fig. 24. Temperature distribution through the thyristor mounted between heatsinks at 50%

Fig. 25. Temperature distribution through the thyristor mounted between heatsinks at 50%

cross section, yz plane

cross section, xz plane

From all previous thermal modelling, simulation and experimental tests, the following conclusions about transient thermal evolution of power semiconductor devices can be outlined:


Extending the model with thermal models for the specific applications enables the user of power semiconductors to choose the right ratings and to evaluate critical load cycles and to identify potential overload capacities for a dynamic grid loading. It was shown that the described thermal network simulation has a high potential for a variety of different applications:

development support;

**Part 3** 

**Harmonic Distortion** 


#### **5. References**

