**9. References**


convective heat transfer coefficient (kJm-1s-1K-1) or dimensionless geometry

[1] EG&G Technical Services Inc, M. (2004). *Fuel Cell Handbook* (seventh edition), U. S.

[2] Larminie, J. & Dicks, A., M. (2003). *Fuel Cell Systems Explained* (Second edition), John

[3] Dicks, A.L., J. (1998). Advances in catalysts for internal reforming in high temperature

[4] Zhang, H.S.; Weng, S.L. & Su M. (2005). Dynamic modeling and simulation of distributed

fuel cells, *Journal of Power Sources*, 71(1998) pp.111-122.

Department of Energy Office of Fossil Energy National Energy Technology

parameter heat exchanger, *Proceedings of ASME TURBO EXPO* 2005-68293, Nevada,

 dimensionless geometry parameter used in formula (13) and (15) dimensionless geometry parameter used in formula (13) and (15)

H, H0 enthalpy change and enthalpy change at the standard state (kJmol-1)

*S* passage heat transfer surface (m)

*t* fin or plate thickness (m), time (s)

*W* whole heat exchanger width (m)

parameter used in formula (13) and (15)

thermal conductivity (kJm-1s-1K-1)

*St* Stanton number *T* temperature (K)

*U* wet perimeter (m) *u* velocity (ms-1)

*X* passage width (m) *Y* passage height (m)

density (kgm-3)

 fin efficiency friction resistance dynamic viscosity (Pa.s)

*P* pressure loss (Pa)

i fuel component w solid fin structure (I) steam reforming reaction (II) gas shifting reaction

(III) CO2 direct reforming reaction

Laboratory. New York, USA.

Wiley & Sons Ltd, England.

USA, June 14-17, 2005.

**Greek letters** 

**Subscripts** 

c cold side f fin h hot side

**9. References** 


**10** 

*1Vietnam 2Taiwan 3,4P. R. China* 

**Single-Phase Heat Transfer and Fluid Flow Phenomena** 

Suyi Huang3, Shiping Jin3 and Jieqing Zheng4

*3School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan,* 

*Technical Education,Hochiminh City,* 

**of Microchannel Heat Exchangers** 

Thanhtrung Dang1, Jyh-tong Teng2, Jiann-cherng Chu2, Tingting Xu3,

*1Department of Heat and Refrigeration Technology, Hochiminh City University of* 

*4College of Mechanical Engineering, Jimei University, Xiamen, Fujian,* 

*2Department of Mechanical Engineering, Chung Yuan Christian University, Chung-Li,* 

In recent years, microfabrication technologies have been utilized in the fields of process engineering using microchannel devices as heat exchangers. The microchannel heat transfer means is of importance to the areas of small and confined spaces, high heat flux devices for cooling electronic components, or other cooling applications in thermal and chemical engineering. Increasing the heat transfer rate and decreasing characteristic dimension of a heat exchanger are key design requirements, and a micro heat exchanger satisfies these

A review of micro heat exchanger related issues such as flow behaviors, fabrication methods, and practical applications was done by Bowman and Maynes [1]. The review firstly introduced the experimental and numerical investigations of channel flow. Subsequently, Friction and heat transfer measurements of gas flow and liquid flow were discussed in the paper. The paper indicated that the transition Reynolds number is a function of surface roughness and channel geometry. Moreover, in the paper, the heat exchanger designs – including their comparison and optimization – were also reviewed. Furthermore, several fabrication methods including micromachining, chemical etching, laser

Review of the experimental results concerning single-phase convective heat transfer in microchannels was presented by Morini [2], with additional review of the results obtained for friction factor, laminar-to-turbulent transition, and Nusselt number in channels having hydraulic diameters less than 1 mm. Dang [3] and Dang et al. [4] presented the fluid flow

machining, electroplating, and lamination, were discussed.

**1. Introduction** 

needs.

