**6. Nomenclature**


Single-Phase Heat Transfer and Fluid Flow Phenomena of Microchannel Heat Exchangers 287

[5] J.J. Brandner, L. Bohn, T. Henning, U. Schygulla and K. Schubert (2006): Microstructure

heat exchanger applications in laboratory and industry, Proceedings of ICNMM2006, Limerick , Ireland, June 19-21, ICNMM2006-96017, pp. 1233-1243 [6] S.W. Kang and S.C. Tseng (2007): Analysis of effectiveness and pressure drop in micro cross-flow heat exchanger, *Applied Thermal Engineering*, Vol. 27, 877-885 [7] T. Henning, J.J. Brandner and K. Schubert (2004): Characterisation of electrically powered micro-heat exchangers, *Chemical Engineering Journal*, Vol. 101, 339-345 [8] J.J. Brandner, E. Anurjew, L. Bohn, E. Hansjosten, T. Henning, U. Schygulla, A. Wenka,

and K. Schubert (2006): Concepts and realization of microstructure heat exchangers for enhanced heat transfer, *Experimental Thermal and Fluid Science*, Vol. 30, 801-809 [9] E. R. Delsman, M. H. J. M. de Croon, G. J. Kramer, P. D. Cobden, Ch. Hofmann, V.

Cominos and J. C. Schouten (2004): Experiments and modelling of an integrated preferential oxidation–heat exchanger microdevice, *Chemical Engineering Journal,*

Cominos and J.C. Schouten (2004): Design and operation of a preferential oxidation microdevice for a portable fuel processor, *Chemical Engineering Science*, Vol. 59,

heaters with its micro-scale impingement cooling process analysis and

simulation of ceramic micro heat exchangers, *Chemical Engineering Journal*, Vol. 135,

application of plastic microcapillary films for fast transient micro-heat exchange,

small scale micro-channel and porous-media heat-exchangers, *Int. J. Heat Mass* 

method of fabrication of heat transfer surfaces with micro-structured profile, *Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with* 

exchanger for stacked multi-chip module, *Sensors and Actuators A: Physical*, Vol.

geometry on the performance of a counter flow microchannel heat exchanger, *Int. J.* 

technologies applied to energy systems, *Energy Conversion and Management*, Vol. 38,

[10] E.R. Delsman, M.H.J.M.D Croon, A. Pierik, G.J. Kramer, P.D. Cobden, Ch. Hofmann, V.

[11] C. H. Shen and C. Gau (2004): Heat exchanger fabrication with arrays of sensors and

[12] C. Gillot, A. Bricard and C. Schaeffer (2000): Single and two-phase heat exchangers for power electronic components, *Int. J. of Thermal Sciences*, Vol. 39, 826-832 [13] B. Alm, U. Imke, R. Knitter, U. chygulla and S. Zimmermann (2008): Testing and

[14] B. Hallmark, C.H. Hornung, D. Broady, C. Price-Kuehne and M.R. Mackley (2008): The

[15] P.X. Jiang, M.H. Fan, G.S. Si and Z.P. Ren (2001): Thermal–hydraulic performance of

[16] Schulz, G.N. Akapiev, V.V. Shirkova, H. Rösler and S.N. Dmitriev (2005): A new

[17] H. Lee, Y. Jeong, J. Shin, J. Baek, M. Kang and K. Chun (2004): Package embedded heat

[18] X. Wei (2004): Stacked microchannel heat sinks for liquid cooling of microelectronics devices, Ph.D. thesis, Academic Faculty, Georgia Institute of Technology [19] M.I. Hasan, A.A. Rageb, M. Yaghoubi, and H. Homayoni (2009): Influence of channel

[20] T.A. Ameel, R.O. Warrington, R.S. Wegeng and M.K. Drost (1997): Miniaturization

[21] T.T. Dang, Y.J. Chang and J.T. Teng (2009): A study on the simulations of a trapezoidal shaped micro heat exchanger, *Journal of Advanced Engineering*, Vol. 4, 397-402

measurements, *Sensors and Actuators A: Physical*, Vol. 114, 154-162

*Int. J. Heat Mass Transfer*, Vol. 51, 5344-5358

*Materials and Atoms*, Vol. 236, 254-258

*Thermal Sciences*, Vol. 48, 1607-1618

*Transfer*, Vol. 44, 1039-1051

Vol. 101, 123-131

4795-4802

S179-S184

114, 204-211

969–982


## **Greek symbols**

