**Author details**

Yan Xia1,2\* and Lu Jia1

1 Yunnan Provincial Key Laboratory of Wood Adhesives and Glued Products, Southwest Forestry University, Kunming, China

2 Department of Civil and Environmental Engineering, Brunel University London, Uxbridge, UK

\*Address all correspondence to: xiayanswfu@gmail.com

© 2023 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

*Wood Degradation by Fungi and Environmentally Benign Wood Preservatives DOI: http://dx.doi.org/10.5772/intechopen.112033*
