**3. Suppliers and main semiconductor's companies**

Semiconductor devices are made on a single wafer or an epitaxial wafer with a single wafer as the substrate. The Czochralski is a typical melting growth method to create single crystals. The next steps in the semiconductor process are crystal orientation, barrel grinding, reference surface, slicing, grinding, chamfering, polishing, etching, cleaning, inspection, packaging, etc., to produce the final wafer. The growth of a single-crystal thin film into a single-crystal substrate can be made by epitaxy, chemical vapor deposition, magnetron sputtering, and other methods [12, 13].

The modern global semiconductor industry according to [14] is generally divided into two models:


Semiconductor manufacturing is an integrated, multi-stage process that occupies a big part of the industry chain, such as semiconductor designers and manufacturing suppliers. It includes silicon wafers, photoresists, wet electronic chemicals, electronic gases, reagents, CMP polishing materials, and target materials. Chip packaging materials include package substrates, lead frames, resins, bonding wires, solder balls, and plating solutions [12].
