**4.5 Electrophoretic deposition, electrolytic deposition, physical/chemical vapor deposition, and spurting**

Many methods are available to attach electrodes with active materials, such as electrophoretic deposition, electrolytic deposition, physical/chemical vapor deposition [44], and spurting. The substrate and collectors can be deposited by atmospheric application, where the active materials will be deposited on the conductive metal-organic frameworks. The same method has also shown to be suitable for use in conductive polymers, which are also one of the main active materials with high quality and stability.

### **4.6 Sacrificial template**

In terms of geometries, key design considerations can be used to increase the surface areas of electrodes, where a sacrificial template is used to increase the area of the electrode. These sacrificial templates include AAO film, polystyrene colloidal particles film, and cube sugar. Template films can be built with sacrificed nanoparticles, which can be dissolved with the target reagent. Pre-curve PDMS has usually been used as the supporting film, while the AAO template has also shown to be a fantastic sacrifice film with a controllable shape, on the nanoscale [30].

#### **4.7 Transfer printing technologies and screen printing**

Transfer printing and screen printing are mature technologies that transfer the shape from the donor wafer to the receiving substrate. After printing, the inks will be released from the stamp to form the desired functional layouts on the receiver substrate. The inks for transfer printing include various organic materials and carbon materials, which can be used to fabricate the flexible and stretchable circuits and supercapacitors [45].

Over the discussion mentioned earlier, many technologies have already been used to design and fabricate the supercapacitors; however, the main works is still focusing on increasing the energy density of the active materials and shape designing for active materials. These new fabrications technologies are hopefully to increase the density of the supercapacitors with suitable active materials.
