**6. Conclusion**

Sputter deposition was long regarded a black art, but today's spectrum of material types that can be deposited has greatly expanded. Sputtering technologies with low cost, the capacity for large-area films, and unique kinetic regime of deposition material can be used to create epitaxial complex oxide, carefully regulated heterostructures, superlattices of the best quality, and film repeatability.

Sputtering yield is affected by a variety of factors, including sputtering angle, incidence ion mass, dosage, and energy of impact ions. If the sputtering pressure is too high, material dispersion back to the target reduces the deposition rate dramatically. Higher pressures alter the film growth process and film morphology significantly. High Vacuum conditions are required for accurate measurements of the absolute sputtering yield so that impurities do not deposit on the sample during analysis. When it comes to designing thin film characteristics, the reactive sputtering technique is crucial. IBSD is a flexible method for customizing the properties of film-forming particles. Due to its flexibility and scalability, magnetron sputtering remains an intriguing and widely utilized technology, and has thus established a strong position for large-area thin film deposition. This explains why sputter deposition has such a broad range of applications. Sputtering procedures that lower impurity content are now available. As a result, research into a fuller description of this technique is ongoing.

This is a strong technology for creating materials that cannot be made any other way, and it'll only get more essential as time goes on. Despite how simple the approach is to apply; it poses enough hurdles to be scientifically fascinating. This explains why it is so popular among academics. There are, nevertheless, some unexpected elements to be uncovered, explained, and used.
