Introduction to Ultra-Wideband Technologies

**3**

**Chapter 1**

*Albert Sabban*

**1. Introduction**

using a 40–46 GHz IF is presented in [8].

modules, and antennas, as presented in [16–19].

using miniature MMIC and MIC components.

**2.1 MIC-microwave integrated circuits devices**

**2. MIC and MMIC microwave and MM wave technologies**

Introductory Chapter:

Ultra-Wideband Technologies

Minimization of the size, cost, and weight of the UWB RF modules and antennas is achieved by employing MMIC, MIC and MEMS technologies. However, integration of MIC, MMIC and MEMS components and modules raise technical challenges such as efficiency, accuracy, and tight tolerances. Design consideration and tolerances that can be ignored at low narrow band frequencies cannot be neglected in the design of UWB integrated RF modules. Advanced RF design software, such as ADS, CST, HFSS and AWR, should be used to achieve accurate design of UWB microwave communication devices in mm-wave frequencies. Accurate design of microwave modules and antennas is a must in development of UWB systems. It is an impossible mission to tune microwave devices in the production line. Design of wideband UWB RF modules, filters and antennas are presented in [1–12]. Wideband RF technologies such as MIC, MIMIC and MEMS are presented in [1–7]. Wide band RF modules are crucial in the development of Direction finding, DF, systems. A fully integrated 10–40 GHz superheterodyne receiver frontend

Wideband RF technologies are used to develop wideband RF modules such as frontends, active antennas and receiving and transmitting channels as presented in [1–15]. Communication and radar industry in mm wave are currently in continuous growth. The demand for wide bandwidth makes the Ka-band attractive for future commercial communication and radar industry. ADS, HFSS, AWR, and CST are system and electromagnetic software used to develop wideband RF systems,

Compact low cost UWB systems may be developed and manufactured only by

devices. Hybrid Microwave Integrated Circuit is named as HMIC device. In MIC design active and passive components are soldered or bonded to the dielectric substrate.

Communication RF devices and systems consist usually of connectorized modules (such us Mixers, Amplifiers, Filters, and circulators) connected by cables. Connectorized devices are not compact and have big volume. They suffer from high losses and high weight. Volume, weight, and losses may be reduced by using Microwave Integrated Circuits, MIC technology. **Figure 1** presents a MIC Transceiver. MIC devices, standard MIC and miniature HMIC are well known types of MIC
