**2. MIC and MMIC microwave and MM wave technologies**

Compact low cost UWB systems may be developed and manufactured only by using miniature MMIC and MIC components.

#### **2.1 MIC-microwave integrated circuits devices**

Communication RF devices and systems consist usually of connectorized modules (such us Mixers, Amplifiers, Filters, and circulators) connected by cables. Connectorized devices are not compact and have big volume. They suffer from high losses and high weight. Volume, weight, and losses may be reduced by using Microwave Integrated Circuits, MIC technology. **Figure 1** presents a MIC Transceiver. MIC devices, standard MIC and miniature HMIC are well known types of MIC devices. Hybrid Microwave Integrated Circuit is named as HMIC device. In MIC design active and passive components are soldered or bonded to the dielectric substrate.

**Figure 1.** *MIC transceiver prototype for INMARSAT-M ground terminal.*

The capacitors, resistors and other passive elements are produced by using thin or thick film technology. A single level metallization for conductors and transmission lines is used in Standard MIC technology. Multilevel process in which passive elements such as inductors, resistors, capacitors, and passive attenuators are batch deposited on the substrate in Miniature HMIC technology. Active components such as mixers, amplifiers and diodes are soldered or bonded on the substrate.
