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**Chapter 9**

**Abstract**

Effective Parameters on Increasing

Efficiency of Microscale Heat

Cooling in Real Life

*and Mehdi Mohammadi*

which has not been presented before.

**1. Introduction**

**155**

commercialized microscale heat sink, electronic cooling

*Yousef Alihosseini, Amir Rezazad Bari*

Sinks and Application of Liquid

Over the past two decades, electronic technology and miniaturization of electronic devices continue to grow exponentially, and heat dissipation becomes a critical issue for electronic devices due to larger heat generation. So, the need to cool down electronic components has led to the development of multiple cooling methods and microscale heat sinks. This chapter reviewed recent advances in developing an efficient heat sink, including (1) geometry parameters, (2) flow parameters that affect the hydraulic–thermal performance of the heat sink. Also, the main goal of this chapter is to address the current gap between academic research and industry. Furthermore, commercialized electronic cooling devices for various applications are highlighted, and their operating functions are discussed,

**Keywords:** microchannel, micro pin-fin, heat sink, heat transfer, microfluidic,

Seminal advances in microelectronics technology have driven the Integrated Circuit Topographies (ICT) revolution over the last decades. Technologies of miniaturization, fabrication, and integrated circuit/system design are three vital parameters that have underpinned this revolution and allowed continuous and ongoing breakthroughs. However, the heat generated by electronic devices is always a

fundamental problem that forced researchers to improve cooling systems to increase thermal efficiency. Since 85 °*c* is a critical temperature for electronic devices [1], exceed each 1 °*c* above critical temperature causes the reduction of 5% of devices life [2]. There are several methods to cool electronic devices as working fluid that are generally divided into (i) air cooling and (ii) liquid cooling. The efficiency of heat sinks increases due to the high thermal conductivity of liquids compared to air. Also, the increasing surface-to-volume ratio in heat sink leads to higher heat dissipation and extension of the electronic device's lifetime. Tuckerman and Pease [3] studied liquid cooling microchannel in single and multi-phase for the

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