*Effective Parameters on Increasing Efficiency of Microscale Heat Sinks and Application… DOI: http://dx.doi.org/10.5772/intechopen.96467*

and soft lithography [9], laser cutting [10, 11], 3D printing [12, 13], microinjection molding [14] and glass etching for different applications like Point of Care (POC) and diagnosis [15, 16], microbiology [17, 18], drug delivery [19–21], oil and gas [22], micropump [23, 24], particle separation and enrichment [25–27], Organ on a chip [28–30], biosensor [31–34].

Microchannel and micro pin-fin are two types of heat sinks that are used in electronic cooling systems. The microchannel heat sink consists of extended parallel channels in different cross-sections (such as rectangular, hexagonal, triangular, etc.) that coolant flow passes from channels and absorbs heat from the chip. With advances in nano/micro-manufacturing techniques, another type of heat sink used in cooling circuits is a micro pin-fin heat sink. This heat sink type consists of pin-fin arrays in different shapes (like rectangular, hexagonal, elliptic, circular, etc.) and due to the high flow mixing rate, thermal performance increases compared to the microchannel heat sink.
