**4. Applications of heat sinks in real life**

Today, we can observe all levels of technological devices in everyday life, such as smartphones, gaming consoles, PCs, and laptops, etc. Companies changed many parameters to achieve the best performance of devices, including decreasing thickness, enhancing GPU and CPU numbers, and changing the appearance [109].

Based on the last researches, with the increasing number of microprocessors, the heat generation is intensified; thus, heat dissipation becomes a critical issue for thermal researchers. The manufacturer's primary purpose is to achieve the best performance of devices by minimizing device and heat sink size and increasing the heat transfer rate utilizing the different items such as changing the geometrical parameters and working fluids.

In this section, some commercial electronic cooling systems and their operating principles are discussed. The purpose of this section is to establish a link between the scientific and commercial platforms. All effective parameters discussed in previous sections are required to fabricate optimum microchannel/micro pin-fin heat sink.

*Effective Parameters on Increasing Efficiency of Microscale Heat Sinks and Application… DOI: http://dx.doi.org/10.5772/intechopen.96467*
