**2.3 Focused ion beam induced deposition**

Focused ion beam induced deposition (FIBID) is a lithographic technique that uses a highly focused ion beam of gallium ions (Ga+ ), a gas injection system and an organometallic precursor gas to deposit a metallic thin film without the need of a mask onto a substrate. In our case, similar to the EBL lithographic process, to contact single metal oxide nanowires by FIBID, the first step is to place the nanowires between the metallic interdigitated electrodes. Afterwards, the future Pt contacts are designed into a CAD program. During the deposition of the Pt contacts, an injector needle is placed very near to the substrate and upon the interaction between the organometallic compound with the ion beam, the precursor molecules are decomposed into a platinum layer and a volatile organic compound exhausted into the vacuum system. FIBID deposition is limited by the organometallic precursor gas and by the delivery rate of the gas. The deposition of a Pt contact by FIBID leads to the deposition of a carbon amorphous matrix that incorporates Pt nanoparticles implanted with Ga+ ions.
