Imaging of Silicon Pillars by MWCNT Tip

patterned copper tubes (I):

[116] Winter RL, McCarthy M. Dewetting from amphiphilic minichannel surfaces during

Interfaces. 2020;**12**(6):7815-7825

185-186

**4**(2):1600801

**55**:3359-3368

**254**

Characterization of condensation heat transfer. International Journal of Heat and Mass Transfer. 2017;**112**:991-1004

*21st Century Surface Science - a Handbook*

micropatterns. Scientific Reports. 2016;

[124] Ma XH, Zhou XD, Lan Z, Li YM, Zhang Y. Condensation heat transfer enhancement in the presence of noncondensable gas using the interfacial effect of dropwise condensation. International Journal of Heat and Mass Transfer. 2008;**51**(7–8):1728-1737

[125] Zhao Y, Preston DJ, Lu Z, Zhang L,

Queeney J, Wang EN. Effects of millimetric geometric features on dropwise condensation under different vapor conditions. International Journal of Heat and Mass Transfer. 2018;**119**:

**6**:19131

931-938

condensation. ACS Applied Materials &

[117] Cheng Y, Wang Z. New approach for efficient condensation heat transfer. National Science Review. 2019;**6**(2):

[118] Peng BL, Ma XH, Lan Z, Xu W, Wen RF. Analysis of condensation heat transfer enhancement with dropwisefilmwise hybrid surface: Droplet sizes effect. International Journal of Heat and

Mass Transfer. 2014;**77**:785-794

[119] Wu J, Zhang L, Wang Y, Wang P. Efficient and anisotropic fog harvesting on a hybrid and directional surface. Advanced Materials Interfaces. 2017;

[120] Yang K-S, Huang Y-Y, Liu Y-H, Wu S-K, Wang C-C. Enhanced dehumidification via hybrid

hydrophilic/hydrophobic morphology having wedge gradient and drainage channels. Heat and Mass Transfer. 2019;

[121] Gou X, Guo Z. Hybrid hydrophilichydrophobic CuO@TiO2-coated copper mesh for efficient water harvesting.

[122] Sharma CS, Lam CWE, Milionis A, Eghlidi H, Poulikakos D. Self-sustained cascading coalescence in surface

condensation. ACS Applied Materials & Interfaces. 2019;**11**(30):27435-27442

Langmuir. 2020;**36**(1):64-73

[123] Boreyko JB, Hansen RR, Murphy KR, Nath S, Retterer ST, Collier CP. Controlling condensation and frost growth with chemical

**Chapter 14**

**Abstract**

Measuring the Blind Holes:

Aspect Ratio AFM Probe

shape) present above and below the surface.

sidewall, through silicon via (TSV)

**1. Introduction**

**257**

Three-Dimensional Imaging of

through Silicon via Using High

*Imtisal Akhtar, Malik Abdul Rehman and Yongho Seo*

Three-dimensional integration and stacking of semiconductor devices with high

density, its compactness, miniaturization and vertical 3D stacking of nanoscale devices highlighted many challenging problems in the 3D parameter's such as CD (critical dimension) measurement, depth measurement of via holes, internal morphology of through silicon via (TSV), etc. Current challenge in the high-density 3D semiconductor devices is to measure the depth of through silicon via (TSV) without destructing the sample; TSVs are used in 3D stacking devices to connect the wafers stacked vertically to reduce the wiring delay, power dissipation, and of course, the form factor in the integration system. Special probes and algorithms have been designed to measure 3D parameters like wall roughness, sidewall angle, but these are only limited to deep trench-like structures and cannot be applied to structures like via holes and protrusions. To address these problems, we have proposed an algorithm based nondestructive 3D Atomic Force Microscopy (AFM). Using the high aspect ratio (5, 10, 20, 25) multiwall carbon nanotubes (MWCNTs) AFM probe, the depth of holes up to 1 micron is faithfully obtained. In addition to this, internal topography, side walls, and location of via holes are obtained faithfully. This atomic force microscopy technique enables to 3D scan the features (of any

**Keywords:** algorithms, AFM, surface characterization, carbon nanotube, 3D AFM,

Scanning probe microscopy (SPM) over the former 20 years has been intensively used by many research groups due to its applicability in extensive filed of materials. In past 50 years, the most significant advancement in AFM was ranked at second place [1–8]. This is because the application of AFM not limited to the semiconductor field but also covers many wide range fields like chemical group identification [9], cell biological [10], semiconductor to study the properties of the materials at nanoscale [11]. Although, applications and techniques of SPM are diverse in nature, but they do share a common feature, i.e., probe to sense localized or confined signal,

because in many cases the probe that confines the spatial accuracy.
