**Author details**

*Material Flow Analysis*

known as metallurgical bonding.

*the bonded region; R is the rebound region.*

room temperature to 400°C.

temperature to 400°C.

**Acknowledgements**

Irinah's PhD scholarship.

University of Technology.

**4. Conclusions**

**Figure 8.**

400°C annealed 1050 is newly formed substrate surface that free from oxide with TiO2 particle which is similar with the cold spraying of metallic materials that

*FIB cross-section of a single particle of TiO2 on 400°C-annealed Al 1050. J indicates the jetted-out region; B is* 

This study investigated the correlation between the adhesion strength of coldsprayed TiO2 on Al 1050 pure aluminum—annealed at temperatures ranging from

3.88 MPa to 2.05 MPa as annealed substrate temperature increased from room

1.The adhesion strength of TiO2 coating showed a decreased trend from

2.The oxide film thickness had an influence on the TiO2 deposition process

3.The main bonding mechanism is metallurgical bonding which is newly form substrate surface of annealed Al 1050 that oxide free to TiO2 particle.

We also acknowledge the Interface & Surface Fabrication lab, Majlis Amanah Rakyat, MARA and the Universiti Teknikal Malaysia Melaka, UTeM for Noor

This research is supported by JSPS KAKENHI Grant Number JP17K06857 and was partially carried out at the Cooperative Research Facility Center at Toyohashi

because thick oxide film inhibits formation of a new surface.

**48**

**Funding**

Noor Irinah Omar1,2\*, Motohiro Yamada1 , Toshiaki Yasui1 and Masahiro Fukumoto1

1 Department of Mechanical Engineering, Toyohashi University of Technology, Tempaku-Cho, Toyohashi, Aichi, Japan

2 Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka, Durian Tunggal, Melaka, Malaysia

\*Address all correspondence to: noor.irinah.binti.omar.dj@tut.ac.jp; nooririnah@utem.edu.my

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