**Author details**

Jihoon Seo Department of Chemical and Biomolecular Engineering and Center for Advanced Materials Processing, Clarkson University, Potsdam, New York, United States of America

\*Address all correspondence to: jseo@clarkson.edu

© 2020 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/ by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

**313**

*117*, 131-138.

*Chemical Mechanical Planarization-Related to Contaminants: Their Sources and Characteristics*

[9] Krishnan, M.; Lofaro, M., Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-ofline (BEOL) and beyond. In *Advances in Chemical Mechanical Planarization (CMP)*, Elsevier: 2016; pp 27-46.

[10] Khanna, A. J.; Kakireddy, V. R.; Fung, J.; Jawali, P.; Yamamura, M.; Kenchappa, N. B.; Hariharan, V.; Redfield, D.; Bajaj, R., High-Performance Pad Conditioning (HPPC) Arm for Augmenting CMP Performance. *ECS Journal of Solid State Science and Technology* **2020,** *9* (6),

[11] Khanna, A. J.; Yamamura, M.; Kakireddy, V. R.; Chockalingam, A.; Jawali, P.; Kenchappa, N. B.; Hariharan, V.; Redfield, D.; Bajaj, R., Investigation of the Impact of Pad Surface Texture from Different Pad Conditioners on the CMP Performance. *ECS Journal of Solid State Science and Technology* **2020,** *9* (6),

[12] Lefevre, P., Defects Observed on the Wafer after the CMP Process. *Microelectronic Applications of Chemical Mechanical Planarization* **2007**, 511-561.

[13] Tseng, W.-T., Approaches to defect characterization, mitigation, and reduction. In *Advances in Chemical Mechanical Planarization (CMP)*, Elsevier: 2016; pp 433-462.

[14] Alety, S. R.; Lagudu, U. R.; Popuri, R.; Patlolla, R.; Surisetty, C. V.; Babu, S., Cleaning Solutions for Ultrathin Co Barriers for Advanced Technology Nodes. *ECS Journal of Solid State Science* 

*and Technology* **2017,** *6* (9), P671.

[15] Chen, Y.; Mikhaylichenko, K.; Brown, B.; Redeker, F., Post-CMP Cleaning. In *Handbook of Silicon Wafer Cleaning Technology*, Elsevier: 2018; pp

064012.

064011.

253-301.

*DOI: http://dx.doi.org/10.5772/intechopen.94292*

[1] Seo, J., A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization. *Journal of Materials* 

[2] Suryadevara, B., *Advances in chemical* 

*mechanical planarization (CMP)*. Woodhead Publishing: 2016.

*reviews* **2010,** *110* (1), 178-204.

[3] Krishnan, M.; Nalaskowski, J. W.; Cook, L. M., Chemical mechanical planarization: slurry chemistry, materials, and mechanisms. *Chemical* 

[4] Srinivasan, R.; Dandu, P. V.; Babu, S., Shallow trench isolation chemical mechanical planarization: A review. *ECS Journal of Solid State Science and Technology* **2015,** *4* (11), P5029-P5039.

[5] Seo, J.; Moon, J.; Moon, S.; Paik, U., Interpolymer complexes of poly (acrylic acid) and poly (ethylene glycol) for low dishing in STI CMP. *Applied Surface* 

[6] Seo, J.; Moon, J.; Bae, J.-Y.; Yoon, K. S.; Sigmund, W.; Paik, U., Control of adhesion force between ceria particles and polishing pad in shallow trench isolation chemical mechanical planarization. *Journal of nanoscience and nanotechnology* **2014,** *14* (6), 4351-4356.

[7] You, K.; Seo, J.; Kim, P. J. H.; Song, T., Control of Tungsten Protrusion with Surface Active Agent during Tungsten Chemical Mechanical Polishing. *ECS Journal of Solid State Science and Technology* **2017,** *6* (12), P822-P827.

[8] Seo, J.; Kim, J. H.; Lee, M.; You, K.; Moon, J.; Lee, D.-H.; Paik, U., Multiobjective optimization of tungsten CMP slurry for advanced semiconductor manufacturing using a response surface methodology. *Materials & Design* **2017,**

*Science* **2015,** *353*, 499-503.

**References**

*Research* **2020**, 1-23.

*Chemical Mechanical Planarization-Related to Contaminants: Their Sources and Characteristics DOI: http://dx.doi.org/10.5772/intechopen.94292*
